MEMS microphone and electronic equipment

MEMS microphone and electronic equipment

The invention relates to the technical field of microphones, in particular to an MEMS microphone and electronic equipment. The MEMS microphone comprises a circuit board, a shell, an MEMS chip and a double-layer gasket, the circuit board is provided with a sound hole, the MEMS chip is connected with...

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Hauptverfasser: LIU GENGLIANG, DONG NANJING
Format: Patent
Sprache:chi ; eng
Schlagworte:
DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
PUBLIC ADDRESS SYSTEMS
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creator LIU GENGLIANG
DONG NANJING
description The invention relates to the technical field of microphones, in particular to an MEMS microphone and electronic equipment. The MEMS microphone comprises a circuit board, a shell, an MEMS chip and a double-layer gasket, the circuit board is provided with a sound hole, the MEMS chip is connected with the circuit board, the MEMS chip and the sound hole are arranged correspondingly, the shell covers the circuit board, a sound cavity is defined by the shell and the circuit board, the MEMS chip is arranged in the sound cavity, the double-layer gasket covers the sound hole, and the double-layer gasket covers the circuit board. The double-layer gasket comprises a first layer, a second layer and a through hole penetrating through the first layer and the second layer, the sound hole is communicated with the sound cavity through the through hole, the first layer faces the sound cavity, the second layer faces the sound hole, and the side, facing the sound hole, of the second layer is sticky. According to the MEMS microph
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118890588A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118890588A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118890588A3</originalsourceid><addsrcrecordid>eNrjZNDwdfUNVsjNTC7KL8jIz0tVSMxLUUjNSU0uKcrPy0xWSC0szSzITc0r4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoYWFpYGphYWjsbEqAEAuPwoSA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MEMS microphone and electronic equipment</title><source>esp@cenet</source><creator>LIU GENGLIANG ; DONG NANJING</creator><creatorcontrib>LIU GENGLIANG ; DONG NANJING</creatorcontrib><description>The invention relates to the technical field of microphones, in particular to an MEMS microphone and electronic equipment. The MEMS microphone comprises a circuit board, a shell, an MEMS chip and a double-layer gasket, the circuit board is provided with a sound hole, the MEMS chip is connected with the circuit board, the MEMS chip and the sound hole are arranged correspondingly, the shell covers the circuit board, a sound cavity is defined by the shell and the circuit board, the MEMS chip is arranged in the sound cavity, the double-layer gasket covers the sound hole, and the double-layer gasket covers the circuit board. The double-layer gasket comprises a first layer, a second layer and a through hole penetrating through the first layer and the second layer, the sound hole is communicated with the sound cavity through the through hole, the first layer faces the sound cavity, the second layer faces the sound hole, and the side, facing the sound hole, of the second layer is sticky. According to the MEMS microph</description><language>chi ; eng</language><subject>DEAF-AID SETS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS ; PUBLIC ADDRESS SYSTEMS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241101&amp;DB=EPODOC&amp;CC=CN&amp;NR=118890588A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241101&amp;DB=EPODOC&amp;CC=CN&amp;NR=118890588A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU GENGLIANG</creatorcontrib><creatorcontrib>DONG NANJING</creatorcontrib><title>MEMS microphone and electronic equipment</title><description>The invention relates to the technical field of microphones, in particular to an MEMS microphone and electronic equipment. The MEMS microphone comprises a circuit board, a shell, an MEMS chip and a double-layer gasket, the circuit board is provided with a sound hole, the MEMS chip is connected with the circuit board, the MEMS chip and the sound hole are arranged correspondingly, the shell covers the circuit board, a sound cavity is defined by the shell and the circuit board, the MEMS chip is arranged in the sound cavity, the double-layer gasket covers the sound hole, and the double-layer gasket covers the circuit board. The double-layer gasket comprises a first layer, a second layer and a through hole penetrating through the first layer and the second layer, the sound hole is communicated with the sound cavity through the through hole, the first layer faces the sound cavity, the second layer faces the sound hole, and the side, facing the sound hole, of the second layer is sticky. According to the MEMS microph</description><subject>DEAF-AID SETS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</subject><subject>PUBLIC ADDRESS SYSTEMS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDwdfUNVsjNTC7KL8jIz0tVSMxLUUjNSU0uKcrPy0xWSC0szSzITc0r4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoYWFpYGphYWjsbEqAEAuPwoSA</recordid><startdate>20241101</startdate><enddate>20241101</enddate><creator>LIU GENGLIANG</creator><creator>DONG NANJING</creator><scope>EVB</scope></search><sort><creationdate>20241101</creationdate><title>MEMS microphone and electronic equipment</title><author>LIU GENGLIANG ; DONG NANJING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118890588A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>DEAF-AID SETS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</topic><topic>PUBLIC ADDRESS SYSTEMS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU GENGLIANG</creatorcontrib><creatorcontrib>DONG NANJING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU GENGLIANG</au><au>DONG NANJING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MEMS microphone and electronic equipment</title><date>2024-11-01</date><risdate>2024</risdate><abstract>The invention relates to the technical field of microphones, in particular to an MEMS microphone and electronic equipment. The MEMS microphone comprises a circuit board, a shell, an MEMS chip and a double-layer gasket, the circuit board is provided with a sound hole, the MEMS chip is connected with the circuit board, the MEMS chip and the sound hole are arranged correspondingly, the shell covers the circuit board, a sound cavity is defined by the shell and the circuit board, the MEMS chip is arranged in the sound cavity, the double-layer gasket covers the sound hole, and the double-layer gasket covers the circuit board. The double-layer gasket comprises a first layer, a second layer and a through hole penetrating through the first layer and the second layer, the sound hole is communicated with the sound cavity through the through hole, the first layer faces the sound cavity, the second layer faces the sound hole, and the side, facing the sound hole, of the second layer is sticky. According to the MEMS microph</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
PUBLIC ADDRESS SYSTEMS
title MEMS microphone and electronic equipment
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T09%3A42%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIU%20GENGLIANG&rft.date=2024-11-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN118890588A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true