Thermally conductive sheet
The present invention provides a heat-conducting sheet which comprises a binder and a heat-conducting filler dispersed in the binder and is used by being sandwiched between a heat-generating body and a heat-dissipating body, wherein the reflectivity of the surface of the heat-conducting sheet that i...
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| creator | KUDOH HIROKI KUROO KENTA IWASAKI HIROMICHI |
| description | The present invention provides a heat-conducting sheet which comprises a binder and a heat-conducting filler dispersed in the binder and is used by being sandwiched between a heat-generating body and a heat-dissipating body, wherein the reflectivity of the surface of the heat-conducting sheet that is in contact with the heat-generating body or the heat-dissipating body is 0.30% or more.
本发明提供一种包含粘合剂和分散于该粘合剂中的导热填料，且被发热体和散热体夹持而使用的导热片，所述导热片的与上述发热体或上述散热体接触的表面的反射率为0.30％以上。 |
| format | Patent |
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本发明提供一种包含粘合剂和分散于该粘合剂中的导热填料，且被发热体和散热体夹持而使用的导热片，所述导热片的与上述发热体或上述散热体接触的表面的反射率为0.30％以上。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241029&DB=EPODOC&CC=CN&NR=118872050A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241029&DB=EPODOC&CC=CN&NR=118872050A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUDOH HIROKI</creatorcontrib><creatorcontrib>KUROO KENTA</creatorcontrib><creatorcontrib>IWASAKI HIROMICHI</creatorcontrib><title>Thermally conductive sheet</title><description>The present invention provides a heat-conducting sheet which comprises a binder and a heat-conducting filler dispersed in the binder and is used by being sandwiched between a heat-generating body and a heat-dissipating body, wherein the reflectivity of the surface of the heat-conducting sheet that is in contact with the heat-generating body or the heat-dissipating body is 0.30% or more.
本发明提供一种包含粘合剂和分散于该粘合剂中的导热填料，且被发热体和散热体夹持而使用的导热片，所述导热片的与上述发热体或上述散热体接触的表面的反射率为0.30％以上。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAKyUgtyk3MyalUSM7PSylNLsksS1UozkhNLeFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGFhbmRgamBo7GxKgBAGN_I0A</recordid><startdate>20241029</startdate><enddate>20241029</enddate><creator>KUDOH HIROKI</creator><creator>KUROO KENTA</creator><creator>IWASAKI HIROMICHI</creator><scope>EVB</scope></search><sort><creationdate>20241029</creationdate><title>Thermally conductive sheet</title><author>KUDOH HIROKI ; KUROO KENTA ; IWASAKI HIROMICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118872050A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KUDOH HIROKI</creatorcontrib><creatorcontrib>KUROO KENTA</creatorcontrib><creatorcontrib>IWASAKI HIROMICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUDOH HIROKI</au><au>KUROO KENTA</au><au>IWASAKI HIROMICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermally conductive sheet</title><date>2024-10-29</date><risdate>2024</risdate><abstract>The present invention provides a heat-conducting sheet which comprises a binder and a heat-conducting filler dispersed in the binder and is used by being sandwiched between a heat-generating body and a heat-dissipating body, wherein the reflectivity of the surface of the heat-conducting sheet that is in contact with the heat-generating body or the heat-dissipating body is 0.30% or more.
本发明提供一种包含粘合剂和分散于该粘合剂中的导热填料，且被发热体和散热体夹持而使用的导热片，所述导热片的与上述发热体或上述散热体接触的表面的反射率为0.30％以上。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Thermally conductive sheet |
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