Thermoplastic silicone elastomers made from compatibilized polyamide resins
A method for preparing a thermoplastic elastomer is disclosed, said method comprising(I) mixing(A) a rheologically stable polyamide resin having a melting point or glass transition temperature of 25° C. to 275° C.,(B) a silicone base comprising(B') 100 parts by weight of a diorganopolysiloxane...
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| creator | C. M. BREWER I CHORVATH M. K. LEE |
| description | A method for preparing a thermoplastic elastomer is disclosed, said method comprising(I) mixing(A) a rheologically stable polyamide resin having a melting point or glass transition temperature of 25° C. to 275° C.,(B) a silicone base comprising(B') 100 parts by weight of a diorganopolysiloxane gum having a plasticity of at least 30 and having an average of at least 2 alkenyl groups in its molecule and(B'') 5 to 200 parts by weight of a reinforcing filler, the weight ratio of said silicone base to said polyamide resin is from 35:65 to 85:15,(C) a compatibilizer selected from (i) a coupling agent, (ii) a functional diorganopolysiloxane or (iii) a copolymer comprising at least one diorganopolysiloxane block and at least one block selected from polyamide, polyether, polyurethane, polyurea, polycarbonate or polyacrylate,(D) an organohydrido silicon compound which contains an average of at least 2 silicon-bonded hydrogen groups in its molecule and(E) a hydrosilation catalyst, components (D) and (E) being present in an amount sufficient to cure said diorganopolysiloxane (B'); and(II) dynamically curing said diorganopolysiloxane (B'). |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1188468CC</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1188468CC</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1188468CC3</originalsourceid><addsrcrecordid>eNqNijEKAjEQRbexEPUOcwGLRZH0QREEq-2XMfsXA5lMyKTR07uCB7B68N5bd7fhiSpaEluLgSymGDSD8BUqqEbCE2iuKhRUCrf4WKY3JiqaXixxqRUWs2271czJsPtx09HlPPjrHkVHWOGAjDb6e987dzw57w9_LB9-4TZJ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thermoplastic silicone elastomers made from compatibilized polyamide resins</title><source>esp@cenet</source><creator>C. M. BREWER ; I CHORVATH ; M. K. LEE</creator><creatorcontrib>C. M. BREWER ; I CHORVATH ; M. K. LEE</creatorcontrib><description>A method for preparing a thermoplastic elastomer is disclosed, said method comprising(I) mixing(A) a rheologically stable polyamide resin having a melting point or glass transition temperature of 25° C. to 275° C.,(B) a silicone base comprising(B') 100 parts by weight of a diorganopolysiloxane gum having a plasticity of at least 30 and having an average of at least 2 alkenyl groups in its molecule and(B'') 5 to 200 parts by weight of a reinforcing filler, the weight ratio of said silicone base to said polyamide resin is from 35:65 to 85:15,(C) a compatibilizer selected from (i) a coupling agent, (ii) a functional diorganopolysiloxane or (iii) a copolymer comprising at least one diorganopolysiloxane block and at least one block selected from polyamide, polyether, polyurethane, polyurea, polycarbonate or polyacrylate,(D) an organohydrido silicon compound which contains an average of at least 2 silicon-bonded hydrogen groups in its molecule and(E) a hydrosilation catalyst, components (D) and (E) being present in an amount sufficient to cure said diorganopolysiloxane (B'); and(II) dynamically curing said diorganopolysiloxane (B').</description><edition>7</edition><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; GENERAL PROCESSES OF COMPOUNDING ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050209&DB=EPODOC&CC=CN&NR=1188468C$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050209&DB=EPODOC&CC=CN&NR=1188468C$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>C. M. BREWER</creatorcontrib><creatorcontrib>I CHORVATH</creatorcontrib><creatorcontrib>M. K. LEE</creatorcontrib><title>Thermoplastic silicone elastomers made from compatibilized polyamide resins</title><description>A method for preparing a thermoplastic elastomer is disclosed, said method comprising(I) mixing(A) a rheologically stable polyamide resin having a melting point or glass transition temperature of 25° C. to 275° C.,(B) a silicone base comprising(B') 100 parts by weight of a diorganopolysiloxane gum having a plasticity of at least 30 and having an average of at least 2 alkenyl groups in its molecule and(B'') 5 to 200 parts by weight of a reinforcing filler, the weight ratio of said silicone base to said polyamide resin is from 35:65 to 85:15,(C) a compatibilizer selected from (i) a coupling agent, (ii) a functional diorganopolysiloxane or (iii) a copolymer comprising at least one diorganopolysiloxane block and at least one block selected from polyamide, polyether, polyurethane, polyurea, polycarbonate or polyacrylate,(D) an organohydrido silicon compound which contains an average of at least 2 silicon-bonded hydrogen groups in its molecule and(E) a hydrosilation catalyst, components (D) and (E) being present in an amount sufficient to cure said diorganopolysiloxane (B'); and(II) dynamically curing said diorganopolysiloxane (B').</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNijEKAjEQRbexEPUOcwGLRZH0QREEq-2XMfsXA5lMyKTR07uCB7B68N5bd7fhiSpaEluLgSymGDSD8BUqqEbCE2iuKhRUCrf4WKY3JiqaXixxqRUWs2271czJsPtx09HlPPjrHkVHWOGAjDb6e987dzw57w9_LB9-4TZJ</recordid><startdate>20050209</startdate><enddate>20050209</enddate><creator>C. M. BREWER</creator><creator>I CHORVATH</creator><creator>M. K. LEE</creator><scope>EVB</scope></search><sort><creationdate>20050209</creationdate><title>Thermoplastic silicone elastomers made from compatibilized polyamide resins</title><author>C. M. BREWER ; I CHORVATH ; M. K. LEE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1188468CC3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>C. M. BREWER</creatorcontrib><creatorcontrib>I CHORVATH</creatorcontrib><creatorcontrib>M. K. LEE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>C. M. BREWER</au><au>I CHORVATH</au><au>M. K. LEE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermoplastic silicone elastomers made from compatibilized polyamide resins</title><date>2005-02-09</date><risdate>2005</risdate><abstract>A method for preparing a thermoplastic elastomer is disclosed, said method comprising(I) mixing(A) a rheologically stable polyamide resin having a melting point or glass transition temperature of 25° C. to 275° C.,(B) a silicone base comprising(B') 100 parts by weight of a diorganopolysiloxane gum having a plasticity of at least 30 and having an average of at least 2 alkenyl groups in its molecule and(B'') 5 to 200 parts by weight of a reinforcing filler, the weight ratio of said silicone base to said polyamide resin is from 35:65 to 85:15,(C) a compatibilizer selected from (i) a coupling agent, (ii) a functional diorganopolysiloxane or (iii) a copolymer comprising at least one diorganopolysiloxane block and at least one block selected from polyamide, polyether, polyurethane, polyurea, polycarbonate or polyacrylate,(D) an organohydrido silicon compound which contains an average of at least 2 silicon-bonded hydrogen groups in its molecule and(E) a hydrosilation catalyst, components (D) and (E) being present in an amount sufficient to cure said diorganopolysiloxane (B'); and(II) dynamically curing said diorganopolysiloxane (B').</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | Thermoplastic silicone elastomers made from compatibilized polyamide resins |
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