Wafer positioning assembly, semiconductor processing equipment and wafer positioning method

Wafer positioning assembly, semiconductor processing equipment and wafer positioning method

The invention provides a wafer positioning assembly, semiconductor processing equipment and a wafer positioning method, and belongs to the technical field of semiconductor equipment, the wafer positioning assembly comprises a mechanical arm, a reflecting plate and a positioning piece, the reflecting...

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Hauptverfasser: HUANG HAITAO, QI GUANGJIE, ZHANG JIAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HUANG HAITAO
QI GUANGJIE
ZHANG JIAN
description The invention provides a wafer positioning assembly, semiconductor processing equipment and a wafer positioning method, and belongs to the technical field of semiconductor equipment, the wafer positioning assembly comprises a mechanical arm, a reflecting plate and a positioning piece, the reflecting plate is provided with a positioning hole, the mechanical arm is provided with an alignment hole, and the alignment hole corresponds to the positioning hole in position; the manipulator is provided with a bearing area for placing a wafer, the alignment hole is located in the bearing area, the positioning piece is provided with a marking line, and one surface, bearing the wafer, of the manipulator is a bearing surface; during positioning, the alignment hole is located above the positioning hole, the positioning piece penetrates through the alignment hole and the positioning hole, and the bearing face of the mechanical arm is flush with the marking line. According to the wafer positioning assembly, the manipulator c
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Wafer positioning assembly, semiconductor processing equipment and wafer positioning method
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