Organic silicon heat-proof coating based on hollow nano-microspheres and preparation method of organic silicon heat-proof coating
The invention discloses an organic silicon heat-proof coating based on nano hollow microspheres. The organic silicon heat-proof coating comprises the following components in parts by mass: 90-150 parts of modified organic silicon resin; 8-15 parts of a ceramic forming filler; 5-10 parts of a fluxing...
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| creator | WANG GUOQING ZHU XIAOFEI ZHAN GUOZHU WANG YUE SHI YONGWEI WANG CHENGHAO SONG SHICONG WANG ZHAOLIANG GE RENKUI |
| description | The invention discloses an organic silicon heat-proof coating based on nano hollow microspheres. The organic silicon heat-proof coating comprises the following components in parts by mass: 90-150 parts of modified organic silicon resin; 8-15 parts of a ceramic forming filler; 5-10 parts of a fluxing agent; 55-75 parts of a heat insulation filler; 5 to 15 parts of shape-maintaining filler; 7-15 parts of a flame retardant; 10-15 parts of a curing agent; 0.5 to 1.0 part of a catalyst; 200 to 300 parts of a diluent; the modified organic silicon resin is hydroxyl-terminated methyl phenyl silicon resin comprising a molecular chain segment with a body structure and a molecular chain segment with a linear structure. The invention also discloses a preparation method of the coating. The coating provided by the invention has lower density, higher elongation and lower heat conductivity, meets the technical requirements of aircrafts on light-weight, high-toughness and high-heat-protection coatings, and provides technical |
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The organic silicon heat-proof coating comprises the following components in parts by mass: 90-150 parts of modified organic silicon resin; 8-15 parts of a ceramic forming filler; 5-10 parts of a fluxing agent; 55-75 parts of a heat insulation filler; 5 to 15 parts of shape-maintaining filler; 7-15 parts of a flame retardant; 10-15 parts of a curing agent; 0.5 to 1.0 part of a catalyst; 200 to 300 parts of a diluent; the modified organic silicon resin is hydroxyl-terminated methyl phenyl silicon resin comprising a molecular chain segment with a body structure and a molecular chain segment with a linear structure. The invention also discloses a preparation method of the coating. 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The organic silicon heat-proof coating comprises the following components in parts by mass: 90-150 parts of modified organic silicon resin; 8-15 parts of a ceramic forming filler; 5-10 parts of a fluxing agent; 55-75 parts of a heat insulation filler; 5 to 15 parts of shape-maintaining filler; 7-15 parts of a flame retardant; 10-15 parts of a curing agent; 0.5 to 1.0 part of a catalyst; 200 to 300 parts of a diluent; the modified organic silicon resin is hydroxyl-terminated methyl phenyl silicon resin comprising a molecular chain segment with a body structure and a molecular chain segment with a linear structure. The invention also discloses a preparation method of the coating. The coating provided by the invention has lower density, higher elongation and lower heat conductivity, meets the technical requirements of aircrafts on light-weight, high-toughness and high-heat-protection coatings, and provides technical</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | Organic silicon heat-proof coating based on hollow nano-microspheres and preparation method of organic silicon heat-proof coating |
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