Reflow soldering furnace
The invention relates to the technical field of electronic element processing equipment, in particular to a reflow soldering furnace. The reflow soldering furnace comprises a furnace body and a material placing table, the material placing table is fixedly arranged on the furnace body, a long-strip-s...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | ZHOU LIGUO LIU JUN CHEN TIANYU KONG FANQIU GU MENG SUN LING HAN YAOPENG |
description | The invention relates to the technical field of electronic element processing equipment, in particular to a reflow soldering furnace. The reflow soldering furnace comprises a furnace body and a material placing table, the material placing table is fixedly arranged on the furnace body, a long-strip-shaped flat bearing plate is arranged at the top of the material placing table, and the flat bearing plate is provided with a heating section; the reflow soldering furnace further comprises a material pushing mechanism, the material pushing mechanism comprises a power device and a pushing plate which are connected, and the power device is used for driving the pushing plate to a preset position on the flat bearing plate and controlling the pushing plate to move by a preset distance in the length direction of the storage table. According to the reflow soldering furnace, the material placing table, the bearing plate and the heating section are arranged, so that the reflow soldering furnace adopts a bottom direct heatin |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118720309A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118720309A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118720309A3</originalsourceid><addsrcrecordid>eNrjZJAISk3LyS9XKM7PSUktysxLV0grLcpLTE7lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQVAJXmpJfHOfoaGFuZGBsYGlo7GxKgBAP1NIlc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Reflow soldering furnace</title><source>esp@cenet</source><creator>ZHOU LIGUO ; LIU JUN ; CHEN TIANYU ; KONG FANQIU ; GU MENG ; SUN LING ; HAN YAOPENG</creator><creatorcontrib>ZHOU LIGUO ; LIU JUN ; CHEN TIANYU ; KONG FANQIU ; GU MENG ; SUN LING ; HAN YAOPENG</creatorcontrib><description>The invention relates to the technical field of electronic element processing equipment, in particular to a reflow soldering furnace. The reflow soldering furnace comprises a furnace body and a material placing table, the material placing table is fixedly arranged on the furnace body, a long-strip-shaped flat bearing plate is arranged at the top of the material placing table, and the flat bearing plate is provided with a heating section; the reflow soldering furnace further comprises a material pushing mechanism, the material pushing mechanism comprises a power device and a pushing plate which are connected, and the power device is used for driving the pushing plate to a preset position on the flat bearing plate and controlling the pushing plate to move by a preset distance in the length direction of the storage table. According to the reflow soldering furnace, the material placing table, the bearing plate and the heating section are arranged, so that the reflow soldering furnace adopts a bottom direct heatin</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241001&DB=EPODOC&CC=CN&NR=118720309A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241001&DB=EPODOC&CC=CN&NR=118720309A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHOU LIGUO</creatorcontrib><creatorcontrib>LIU JUN</creatorcontrib><creatorcontrib>CHEN TIANYU</creatorcontrib><creatorcontrib>KONG FANQIU</creatorcontrib><creatorcontrib>GU MENG</creatorcontrib><creatorcontrib>SUN LING</creatorcontrib><creatorcontrib>HAN YAOPENG</creatorcontrib><title>Reflow soldering furnace</title><description>The invention relates to the technical field of electronic element processing equipment, in particular to a reflow soldering furnace. The reflow soldering furnace comprises a furnace body and a material placing table, the material placing table is fixedly arranged on the furnace body, a long-strip-shaped flat bearing plate is arranged at the top of the material placing table, and the flat bearing plate is provided with a heating section; the reflow soldering furnace further comprises a material pushing mechanism, the material pushing mechanism comprises a power device and a pushing plate which are connected, and the power device is used for driving the pushing plate to a preset position on the flat bearing plate and controlling the pushing plate to move by a preset distance in the length direction of the storage table. According to the reflow soldering furnace, the material placing table, the bearing plate and the heating section are arranged, so that the reflow soldering furnace adopts a bottom direct heatin</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAISk3LyS9XKM7PSUktysxLV0grLcpLTE7lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQVAJXmpJfHOfoaGFuZGBsYGlo7GxKgBAP1NIlc</recordid><startdate>20241001</startdate><enddate>20241001</enddate><creator>ZHOU LIGUO</creator><creator>LIU JUN</creator><creator>CHEN TIANYU</creator><creator>KONG FANQIU</creator><creator>GU MENG</creator><creator>SUN LING</creator><creator>HAN YAOPENG</creator><scope>EVB</scope></search><sort><creationdate>20241001</creationdate><title>Reflow soldering furnace</title><author>ZHOU LIGUO ; LIU JUN ; CHEN TIANYU ; KONG FANQIU ; GU MENG ; SUN LING ; HAN YAOPENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118720309A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHOU LIGUO</creatorcontrib><creatorcontrib>LIU JUN</creatorcontrib><creatorcontrib>CHEN TIANYU</creatorcontrib><creatorcontrib>KONG FANQIU</creatorcontrib><creatorcontrib>GU MENG</creatorcontrib><creatorcontrib>SUN LING</creatorcontrib><creatorcontrib>HAN YAOPENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHOU LIGUO</au><au>LIU JUN</au><au>CHEN TIANYU</au><au>KONG FANQIU</au><au>GU MENG</au><au>SUN LING</au><au>HAN YAOPENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Reflow soldering furnace</title><date>2024-10-01</date><risdate>2024</risdate><abstract>The invention relates to the technical field of electronic element processing equipment, in particular to a reflow soldering furnace. The reflow soldering furnace comprises a furnace body and a material placing table, the material placing table is fixedly arranged on the furnace body, a long-strip-shaped flat bearing plate is arranged at the top of the material placing table, and the flat bearing plate is provided with a heating section; the reflow soldering furnace further comprises a material pushing mechanism, the material pushing mechanism comprises a power device and a pushing plate which are connected, and the power device is used for driving the pushing plate to a preset position on the flat bearing plate and controlling the pushing plate to move by a preset distance in the length direction of the storage table. According to the reflow soldering furnace, the material placing table, the bearing plate and the heating section are arranged, so that the reflow soldering furnace adopts a bottom direct heatin</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN118720309A |
source | esp@cenet |
subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
title | Reflow soldering furnace |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T20%3A47%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZHOU%20LIGUO&rft.date=2024-10-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN118720309A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |