Chip heat dissipation device and electronic equipment

The invention provides a chip heat dissipation device and electronic equipment, and relates to the technical field of electronic equipment heat dissipation, the chip heat dissipation device comprises a circuit board, the circuit board is provided with a first chip element and a second chip element,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MAO JIJIN, NI JIANBIN, CHENG FENG, YANG YANG, SHU BIN, BAI SHAOYUN, LI WEIZU, ZHONG HONGQIANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator MAO JIJIN
NI JIANBIN
CHENG FENG
YANG YANG
SHU BIN
BAI SHAOYUN
LI WEIZU
ZHONG HONGQIANG
description The invention provides a chip heat dissipation device and electronic equipment, and relates to the technical field of electronic equipment heat dissipation, the chip heat dissipation device comprises a circuit board, the circuit board is provided with a first chip element and a second chip element, and the heating value of the first chip element is larger than that of the second chip element; the radiator comprises a heat dissipation shell and heat dissipation fins, the heat dissipation shell is fixedly connected with the circuit board, a main heat dissipation cavity, a liquid return cavity and a liquid outlet cavity which are communicated with one another are defined on the inner side of the heat dissipation shell, the heat dissipation fins are arranged in the main heat dissipation cavity, the liquid return cavity and the liquid outlet cavity, and the liquid return cavity and the liquid outlet cavity are communicated with an external cooling device to form a circulation loop; a phase change heat absorption m
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118714726A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118714726A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118714726A3</originalsourceid><addsrcrecordid>eNrjZDB1zsgsUMhITSxRSMksLs4sSCzJzM9TSEkty0xOVUjMS1FIzUlNLinKz8tMVkgtLM0syE3NK-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGFuaGJuZGZo7GxKgBAG2KLVY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Chip heat dissipation device and electronic equipment</title><source>esp@cenet</source><creator>MAO JIJIN ; NI JIANBIN ; CHENG FENG ; YANG YANG ; SHU BIN ; BAI SHAOYUN ; LI WEIZU ; ZHONG HONGQIANG</creator><creatorcontrib>MAO JIJIN ; NI JIANBIN ; CHENG FENG ; YANG YANG ; SHU BIN ; BAI SHAOYUN ; LI WEIZU ; ZHONG HONGQIANG</creatorcontrib><description>The invention provides a chip heat dissipation device and electronic equipment, and relates to the technical field of electronic equipment heat dissipation, the chip heat dissipation device comprises a circuit board, the circuit board is provided with a first chip element and a second chip element, and the heating value of the first chip element is larger than that of the second chip element; the radiator comprises a heat dissipation shell and heat dissipation fins, the heat dissipation shell is fixedly connected with the circuit board, a main heat dissipation cavity, a liquid return cavity and a liquid outlet cavity which are communicated with one another are defined on the inner side of the heat dissipation shell, the heat dissipation fins are arranged in the main heat dissipation cavity, the liquid return cavity and the liquid outlet cavity, and the liquid return cavity and the liquid outlet cavity are communicated with an external cooling device to form a circulation loop; a phase change heat absorption m</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240927&amp;DB=EPODOC&amp;CC=CN&amp;NR=118714726A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240927&amp;DB=EPODOC&amp;CC=CN&amp;NR=118714726A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MAO JIJIN</creatorcontrib><creatorcontrib>NI JIANBIN</creatorcontrib><creatorcontrib>CHENG FENG</creatorcontrib><creatorcontrib>YANG YANG</creatorcontrib><creatorcontrib>SHU BIN</creatorcontrib><creatorcontrib>BAI SHAOYUN</creatorcontrib><creatorcontrib>LI WEIZU</creatorcontrib><creatorcontrib>ZHONG HONGQIANG</creatorcontrib><title>Chip heat dissipation device and electronic equipment</title><description>The invention provides a chip heat dissipation device and electronic equipment, and relates to the technical field of electronic equipment heat dissipation, the chip heat dissipation device comprises a circuit board, the circuit board is provided with a first chip element and a second chip element, and the heating value of the first chip element is larger than that of the second chip element; the radiator comprises a heat dissipation shell and heat dissipation fins, the heat dissipation shell is fixedly connected with the circuit board, a main heat dissipation cavity, a liquid return cavity and a liquid outlet cavity which are communicated with one another are defined on the inner side of the heat dissipation shell, the heat dissipation fins are arranged in the main heat dissipation cavity, the liquid return cavity and the liquid outlet cavity, and the liquid return cavity and the liquid outlet cavity are communicated with an external cooling device to form a circulation loop; a phase change heat absorption m</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB1zsgsUMhITSxRSMksLs4sSCzJzM9TSEkty0xOVUjMS1FIzUlNLinKz8tMVkgtLM0syE3NK-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGFuaGJuZGZo7GxKgBAG2KLVY</recordid><startdate>20240927</startdate><enddate>20240927</enddate><creator>MAO JIJIN</creator><creator>NI JIANBIN</creator><creator>CHENG FENG</creator><creator>YANG YANG</creator><creator>SHU BIN</creator><creator>BAI SHAOYUN</creator><creator>LI WEIZU</creator><creator>ZHONG HONGQIANG</creator><scope>EVB</scope></search><sort><creationdate>20240927</creationdate><title>Chip heat dissipation device and electronic equipment</title><author>MAO JIJIN ; NI JIANBIN ; CHENG FENG ; YANG YANG ; SHU BIN ; BAI SHAOYUN ; LI WEIZU ; ZHONG HONGQIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118714726A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MAO JIJIN</creatorcontrib><creatorcontrib>NI JIANBIN</creatorcontrib><creatorcontrib>CHENG FENG</creatorcontrib><creatorcontrib>YANG YANG</creatorcontrib><creatorcontrib>SHU BIN</creatorcontrib><creatorcontrib>BAI SHAOYUN</creatorcontrib><creatorcontrib>LI WEIZU</creatorcontrib><creatorcontrib>ZHONG HONGQIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MAO JIJIN</au><au>NI JIANBIN</au><au>CHENG FENG</au><au>YANG YANG</au><au>SHU BIN</au><au>BAI SHAOYUN</au><au>LI WEIZU</au><au>ZHONG HONGQIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chip heat dissipation device and electronic equipment</title><date>2024-09-27</date><risdate>2024</risdate><abstract>The invention provides a chip heat dissipation device and electronic equipment, and relates to the technical field of electronic equipment heat dissipation, the chip heat dissipation device comprises a circuit board, the circuit board is provided with a first chip element and a second chip element, and the heating value of the first chip element is larger than that of the second chip element; the radiator comprises a heat dissipation shell and heat dissipation fins, the heat dissipation shell is fixedly connected with the circuit board, a main heat dissipation cavity, a liquid return cavity and a liquid outlet cavity which are communicated with one another are defined on the inner side of the heat dissipation shell, the heat dissipation fins are arranged in the main heat dissipation cavity, the liquid return cavity and the liquid outlet cavity, and the liquid return cavity and the liquid outlet cavity are communicated with an external cooling device to form a circulation loop; a phase change heat absorption m</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN118714726A
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Chip heat dissipation device and electronic equipment
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T11%3A00%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MAO%20JIJIN&rft.date=2024-09-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN118714726A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true