Method for manufacturing processed article, method for manufacturing semiconductor device, and apparatus for manufacturing processed article

The method for manufacturing a processed article includes: a preparation step of preparing an object to be processed (1) including at least a lead frame in which a groove portion (5) is formed in advance along a position to be cut; a surface layer removal step for partially removing a surface layer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HANASAKA SHUHO, ISHIBASHI KANJI, TAKAMORI YUDAI, FUJIWARA NAOMI, NAKAMURA KEIICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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