Temperature control system, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

The present invention provides a technique capable of improving temperature controllability in a processing space in which a substrate is disposed. The temperature control system includes: heating units disposed in each of a plurality of regions; a first temperature sensor configured so as to be capable of operating together with the substrate; other temperature sensors other than the first temperature sensor; and a control unit which is configured so as to assign one of the first temperature sensor and the other temperature sensor to each of the regions, and which is capable of controlling the heating unit on the basis of the temperature detected by one of the first temperature sensor and the other temperature sensor assigned to each of the regions. 本发明提供能够提高配置有基板的处理空间内的温度控制性的技术。温度控制系统具有：在多个区域分别配置的加热部；第1温度传感器，其构成为能够与基板一起动作；所述第1温度传感器以外的其他温度传感器；以及控制部，其构成为针对每个所述区域分别分配所述第1温度传感器和所述其他温度传感器中的某一方，并能够基于由针对每个所述区域分配的、所述第1温度传感器和所述其他温度传感器中的某一方检测的温度来控制所述加热部。