ADHESIVE LAMINATE AND CASE FOR ELECTRONIC DEVICE

Provided is a technique capable of facilitating an integration step of a metal material and a resin and capable of improving the bonding strength between the metal material and the resin. An adhesive laminate (10) according to one embodiment of the present invention is provided with: a base material...

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Hauptverfasser: KONDO YASUFUMI, ITO HIROSHI, TOCHIHIRA JUN
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Sprache:chi ; eng
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creator KONDO YASUFUMI
ITO HIROSHI
TOCHIHIRA JUN
description Provided is a technique capable of facilitating an integration step of a metal material and a resin and capable of improving the bonding strength between the metal material and the resin. An adhesive laminate (10) according to one embodiment of the present invention is provided with: a base material layer (30) comprising a non-woven fabric; and an adhesive layer (20) that is laminated on one main surface of the base material layer and contains an adhesive having a glass transition temperature (Tg) of-40 DEG C to 20 DEG C (inclusive). An adhesive-impregnated layer 32 in which the adhesive is impregnated in a portion of the base material layer 30 on the side adjacent to the adhesive layer 20 is formed. The thickness of the base material layer (30) is 10-100 [mu] m, the thickness of the portion (34) not impregnated with the adhesive in the base material layer (30) is 5-50 [mu] m, and the thickness of the adhesive-impregnated layer (32) in the base material layer (30) is 5-95 [mu] m. The thickness of the adhesive
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An adhesive laminate (10) according to one embodiment of the present invention is provided with: a base material layer (30) comprising a non-woven fabric; and an adhesive layer (20) that is laminated on one main surface of the base material layer and contains an adhesive having a glass transition temperature (Tg) of-40 DEG C to 20 DEG C (inclusive). An adhesive-impregnated layer 32 in which the adhesive is impregnated in a portion of the base material layer 30 on the side adjacent to the adhesive layer 20 is formed. The thickness of the base material layer (30) is 10-100 [mu] m, the thickness of the portion (34) not impregnated with the adhesive in the base material layer (30) is 5-50 [mu] m, and the thickness of the adhesive-impregnated layer (32) in the base material layer (30) is 5-95 [mu] m. 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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
title ADHESIVE LAMINATE AND CASE FOR ELECTRONIC DEVICE
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