Preparation method of thermal interface material based on multi-component composite high-thermal-conductivity filler

A preparation method of a thermal interface material based on a multi-component composite high-thermal-conductivity filler relates to the technical field of a preparation method of a high-thermal-conductivity filler, and comprises the following steps: S1, activation pretreatment of a solid boron sou...

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Bibliographische Detailangaben

Hauptverfasser:	WANG LEJIA, YU LEPING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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