Semiconductor structure and forming method thereof

Semiconductor structures and methods of forming the same are provided. An exemplary semiconductor structure includes a contact pad over a substrate, an under bump metallization (UBM) layer over the contact pad, a metal pillar over the UBM layer and electrically coupled to the contact pad via the UBM...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU YULUN, FENG JIENING, XUE CHANGRONG, LV WENXIONG, ZHENG MINGDA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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