Chip-to-chip stacking by using nickel tin metallization stack and diffusion soldering

The invention discloses a chip-to-chip stack realized by using a nickel tin metallization stack and diffusion welding. A method for manufacturing a semiconductor device includes: providing a substrate layer stack including a substrate having a metal upper surface, a first Ni-containing layer dispose...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN FACAI, KOFLER GEORG, HUANG SENYONG, YAKANATHAN SUBRAMANIAM
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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