SIP (Session Initiation Protocol) packaging equipment

The invention discloses SIP (Session Initiation Protocol) packaging equipment, which comprises a packaging bottom plate, the packaging device comprises a packaging bottom plate, a positioning assembly used for positioning a chip at the center of the upper surface of the packaging bottom plate, a first heat dissipation assembly used for conducting heat dissipation on the chip which is installed and runs, and a second heat dissipation assembly which comprises two cylindrical grooves symmetrically formed in the inner bottom wall of a strip-shaped groove and rotating rods rotationally arranged on the inner bottom walls of the cylindrical grooves. By arranging the first heat dissipation assembly and the second heat dissipation assembly, after the chip is positioned and installed, heat dissipated by the chip can be effectively exchanged, the purpose of water-cooling heat dissipation is achieved, and meanwhile the heat dissipation efficiency is improved before cooling water enters a liquid inlet hose and after the c