SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
The present invention suppresses deterioration in manufacturing cost and device characteristics of a semiconductor device. A method of manufacturing a semiconductor device according to an embodiment includes: forming a laser lift-off film over a first semiconductor substrate; forming a thermal diffu...
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| creator | KASHIWADA SAORI NODA MITSUHIKO |
| description | The present invention suppresses deterioration in manufacturing cost and device characteristics of a semiconductor device. A method of manufacturing a semiconductor device according to an embodiment includes: forming a laser lift-off film over a first semiconductor substrate; forming a thermal diffusion layer, which is distributed in a plane parallel to the surface of the first semiconductor substrate inside the laser lift-off film and includes a member having a higher thermal conductivity than the laser lift-off film, when the laser lift-off film is formed; forming a circuit layer including a semiconductor circuit over the laser lift-off film; after the circuit layer is formed, the first semiconductor substrate is attached to the second semiconductor substrate; after the first semiconductor substrate and the second semiconductor substrate are bonded, the back surface of the first semiconductor substrate is irradiated with laser light; and peeling off the first semiconductor substrate such that the circuit la |
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A method of manufacturing a semiconductor device according to an embodiment includes: forming a laser lift-off film over a first semiconductor substrate; forming a thermal diffusion layer, which is distributed in a plane parallel to the surface of the first semiconductor substrate inside the laser lift-off film and includes a member having a higher thermal conductivity than the laser lift-off film, when the laser lift-off film is formed; forming a circuit layer including a semiconductor circuit over the laser lift-off film; after the circuit layer is formed, the first semiconductor substrate is attached to the second semiconductor substrate; after the first semiconductor substrate and the second semiconductor substrate are bonded, the back surface of the first semiconductor substrate is irradiated with laser light; and peeling off the first semiconductor substrate such that the circuit la</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240903&DB=EPODOC&CC=CN&NR=118588623A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240903&DB=EPODOC&CC=CN&NR=118588623A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KASHIWADA SAORI</creatorcontrib><creatorcontrib>NODA MITSUHIKO</creatorcontrib><title>SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><description>The present invention suppresses deterioration in manufacturing cost and device characteristics of a semiconductor device. 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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
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