High-power chip resistor and manufacturing process thereof
The invention relates to the technical field of chip resistor preparation, and discloses a high-power chip resistor which comprises a resistor body, electrodes and an insulating substrate, the resistor body is in a rectangular shape, the electrodes are located on two opposite edges of the resistor b...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention relates to the technical field of chip resistor preparation, and discloses a high-power chip resistor which comprises a resistor body, electrodes and an insulating substrate, the resistor body is in a rectangular shape, the electrodes are located on two opposite edges of the resistor body, the electrodes are connected with the resistor body through welding, and the insulating substrate is connected with the resistor body through welding. The electrode is connected with other circuit elements through welding, a conductive layer, a resistive layer and a protective layer are sequentially deposited on the substrate, the insulating substrate is located on the resistor body, the resistor body is made of a high-thermal-conductivity material, the resistive layer is made of a nichrome material, the electrode is made of a high-thermal-conductivity material, and the protective layer is made of a high-thermal-conductivity material. The conductive layer is made of a copper material. The resistor body is made |
---|