Full-automatic wafer surface inspection machine and wafer inspection method
The invention relates to the technical field of wafer appearance inspection, and particularly discloses a full-automatic wafer surface inspection machine and a wafer inspection method. The full-automatic wafer surface inspection machine comprises a rack, and a material box, a carrying disc, a manipu...
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| creator | XIAO YUHANG SUN HUIMIN ZHENG LONGJIE CAO XIONGZHEN |
| description | The invention relates to the technical field of wafer appearance inspection, and particularly discloses a full-automatic wafer surface inspection machine and a wafer inspection method. The full-automatic wafer surface inspection machine comprises a rack, and a material box, a carrying disc, a manipulator, a turn-over module, a macroscopic inspection module and a microscopic inspection module which are mounted on the rack. The carrying disc is used for carrying wafers. The turn-over module is provided with a clamping mechanism and a turner. And the turner is arranged on the rack. And the output end of the turner is connected to the clamping mechanism. The clamping mechanism is configured to be capable of clamping the carrying disc. The macroscopic inspection module is provided with a macroscopic station used for bearing the carrying disc. The microcosmic detection module is provided with a microcosmic station used for bearing the carrying disc. The mechanical arm is configured to be capable of carrying the car |
| format | Patent |
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The full-automatic wafer surface inspection machine comprises a rack, and a material box, a carrying disc, a manipulator, a turn-over module, a macroscopic inspection module and a microscopic inspection module which are mounted on the rack. The carrying disc is used for carrying wafers. The turn-over module is provided with a clamping mechanism and a turner. And the turner is arranged on the rack. And the output end of the turner is connected to the clamping mechanism. The clamping mechanism is configured to be capable of clamping the carrying disc. The macroscopic inspection module is provided with a macroscopic station used for bearing the carrying disc. The microcosmic detection module is provided with a microcosmic station used for bearing the carrying disc. 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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | Full-automatic wafer surface inspection machine and wafer inspection method |
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