Solid material remaining amount measurement method, sublimation gas supply method, and sublimation gas supply system
Provided is a measurement method capable of suppressing loss of the residual amount of a solid material inside a solid material container when a sublimation gas of the solid material is supplied to a subsequent process section. The method includes: when a buffer tank is refilled with a sublimation g...
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creator | IDA KENTARO GOTO MIKIO NAKAGAWA TOSHIYUKI |
description | Provided is a measurement method capable of suppressing loss of the residual amount of a solid material inside a solid material container when a sublimation gas of the solid material is supplied to a subsequent process section. The method includes: when a buffer tank is refilled with a sublimation gas: a first residual amount calculation step in which a residual amount of a solid material is calculated from a consumption amount of the sublimation gas fed from the buffer tank to a subsequent process section; a second residual amount calculation step in which the residual amount of the solid material is calculated from the amount of movement of the sublimation gas fed from the solid material container to the buffer tank; and/or a switching determination step in which the switching timing and abnormality are determined according to the residual amount of the solid material inside the solid material container.
提供了一种能够在向后续工艺部供应固体材料的升华气体时抑制固体材料容器内部的固体材料的残留量的损耗的测量方法。该方法包括:当用升华气体重新填充缓冲罐时:第一残留量计算步骤,其中根据从缓冲罐馈送到后续工艺部的升华 |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118541507A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118541507A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118541507A3</originalsourceid><addsrcrecordid>eNqNiz0LwjAQhrM4iPofzl3BoEVXKYqTi-7ltGc9SC6hlwz99wYRN8Hp_XresUmX4LgFj4l6Rgc9eWRh6QB9yJLAE2ouLb19eoZ2AZpvjsuFg0CHWnKMbvjOKO0vRAdN5Kdm9ECnNPvoxMyPh2t9WlIMDWnEOwmlpj5bu6s2tlpt9-t_mBf9-kWp</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Solid material remaining amount measurement method, sublimation gas supply method, and sublimation gas supply system</title><source>esp@cenet</source><creator>IDA KENTARO ; GOTO MIKIO ; NAKAGAWA TOSHIYUKI</creator><creatorcontrib>IDA KENTARO ; GOTO MIKIO ; NAKAGAWA TOSHIYUKI</creatorcontrib><description>Provided is a measurement method capable of suppressing loss of the residual amount of a solid material inside a solid material container when a sublimation gas of the solid material is supplied to a subsequent process section. The method includes: when a buffer tank is refilled with a sublimation gas: a first residual amount calculation step in which a residual amount of a solid material is calculated from a consumption amount of the sublimation gas fed from the buffer tank to a subsequent process section; a second residual amount calculation step in which the residual amount of the solid material is calculated from the amount of movement of the sublimation gas fed from the solid material container to the buffer tank; and/or a switching determination step in which the switching timing and abnormality are determined according to the residual amount of the solid material inside the solid material container.
提供了一种能够在向后续工艺部供应固体材料的升华气体时抑制固体材料容器内部的固体材料的残留量的损耗的测量方法。该方法包括:当用升华气体重新填充缓冲罐时:第一残留量计算步骤,其中根据从缓冲罐馈送到后续工艺部的升华</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; THEIR RELEVANT APPARATUS ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240823&DB=EPODOC&CC=CN&NR=118541507A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240823&DB=EPODOC&CC=CN&NR=118541507A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IDA KENTARO</creatorcontrib><creatorcontrib>GOTO MIKIO</creatorcontrib><creatorcontrib>NAKAGAWA TOSHIYUKI</creatorcontrib><title>Solid material remaining amount measurement method, sublimation gas supply method, and sublimation gas supply system</title><description>Provided is a measurement method capable of suppressing loss of the residual amount of a solid material inside a solid material container when a sublimation gas of the solid material is supplied to a subsequent process section. The method includes: when a buffer tank is refilled with a sublimation gas: a first residual amount calculation step in which a residual amount of a solid material is calculated from a consumption amount of the sublimation gas fed from the buffer tank to a subsequent process section; a second residual amount calculation step in which the residual amount of the solid material is calculated from the amount of movement of the sublimation gas fed from the solid material container to the buffer tank; and/or a switching determination step in which the switching timing and abnormality are determined according to the residual amount of the solid material inside the solid material container.
提供了一种能够在向后续工艺部供应固体材料的升华气体时抑制固体材料容器内部的固体材料的残留量的损耗的测量方法。该方法包括:当用升华气体重新填充缓冲罐时:第一残留量计算步骤,其中根据从缓冲罐馈送到后续工艺部的升华</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>THEIR RELEVANT APPARATUS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNiz0LwjAQhrM4iPofzl3BoEVXKYqTi-7ltGc9SC6hlwz99wYRN8Hp_XresUmX4LgFj4l6Rgc9eWRh6QB9yJLAE2ouLb19eoZ2AZpvjsuFg0CHWnKMbvjOKO0vRAdN5Kdm9ECnNPvoxMyPh2t9WlIMDWnEOwmlpj5bu6s2tlpt9-t_mBf9-kWp</recordid><startdate>20240823</startdate><enddate>20240823</enddate><creator>IDA KENTARO</creator><creator>GOTO MIKIO</creator><creator>NAKAGAWA TOSHIYUKI</creator><scope>EVB</scope></search><sort><creationdate>20240823</creationdate><title>Solid material remaining amount measurement method, sublimation gas supply method, and sublimation gas supply system</title><author>IDA KENTARO ; GOTO MIKIO ; NAKAGAWA TOSHIYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118541507A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>THEIR RELEVANT APPARATUS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>IDA KENTARO</creatorcontrib><creatorcontrib>GOTO MIKIO</creatorcontrib><creatorcontrib>NAKAGAWA TOSHIYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IDA KENTARO</au><au>GOTO MIKIO</au><au>NAKAGAWA TOSHIYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Solid material remaining amount measurement method, sublimation gas supply method, and sublimation gas supply system</title><date>2024-08-23</date><risdate>2024</risdate><abstract>Provided is a measurement method capable of suppressing loss of the residual amount of a solid material inside a solid material container when a sublimation gas of the solid material is supplied to a subsequent process section. The method includes: when a buffer tank is refilled with a sublimation gas: a first residual amount calculation step in which a residual amount of a solid material is calculated from a consumption amount of the sublimation gas fed from the buffer tank to a subsequent process section; a second residual amount calculation step in which the residual amount of the solid material is calculated from the amount of movement of the sublimation gas fed from the solid material container to the buffer tank; and/or a switching determination step in which the switching timing and abnormality are determined according to the residual amount of the solid material inside the solid material container.
提供了一种能够在向后续工艺部供应固体材料的升华气体时抑制固体材料容器内部的固体材料的残留量的损耗的测量方法。该方法包括:当用升华气体重新填充缓冲罐时:第一残留量计算步骤,其中根据从缓冲罐馈送到后续工艺部的升华</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR RELEVANT APPARATUS TRANSPORTING |
title | Solid material remaining amount measurement method, sublimation gas supply method, and sublimation gas supply system |
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