Chip packaging structure and preparation method thereof

The invention relates to the technical field of chip packaging, and discloses a chip packaging structure and a preparation method thereof. The preparation method comprises the steps of providing a substrate; a transfer layer is arranged on the surface of one side of the substrate; a plurality of chi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG AOQI, HAN DONGSHENG, CAI WANGCAN, ZHOU NANJIA, LAO JIAJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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