Chip and preparation method thereof
The invention relates to the technical field of semiconductor packaging, and provides a chip and a preparation method thereof.The chip comprises a substrate, a plurality of insulating layers and a plurality of rewiring layers; the plurality of insulating layers are laid on the substrate, the plurali...
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| creator | WANG SHIZHAO LIU SHENG CHEN ZHIWEN PAN DAN LYU TING OUYANG YUHANG HIGASHIYOSHI |
| description | The invention relates to the technical field of semiconductor packaging, and provides a chip and a preparation method thereof.The chip comprises a substrate, a plurality of insulating layers and a plurality of rewiring layers; the plurality of insulating layers are laid on the substrate, the plurality of insulating layers are stacked in sequence, and each insulating layer is provided with a plurality of grooves, a plurality of limiting cavities and a plurality of micro-copper columns; the plurality of grooves are formed in one side, far away from the substrate, of the insulating layer; each limiting cavity is located on the side, close to the base plate, of the groove and communicates with the groove. The plurality of micro-copper columns and the plurality of grooves are arranged in a one-to-one correspondence manner, and each micro-copper column is filled in the corresponding groove and the corresponding limiting cavity; the multiple rewiring layers and the multiple insulating layers are arranged in a one-to |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Chip and preparation method thereof |
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