Silicon wafer alignment method and silicon wafer alignment system
The invention provides a silicon wafer alignment method and a silicon wafer alignment system, and relates to the field of semiconductors. The method comprises the following steps: acquiring a first image of a silicon wafer to determine the position of a coarse alignment mark in a silicon wafer workb...
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creator | ZHANG QI FU YOUYIN DENG LIJUN ZHANG MANNI LU ZHIMING JIA XUAN |
description | The invention provides a silicon wafer alignment method and a silicon wafer alignment system, and relates to the field of semiconductors. The method comprises the following steps: acquiring a first image of a silicon wafer to determine the position of a coarse alignment mark in a silicon wafer workbench coordinate system, further determining first position offset information of the silicon wafer relative to a mask, and moving the silicon wafer according to the first position offset information; acquiring a second image to determine the position of the fine alignment mark in the silicon wafer workbench coordinate system; and determining second position offset information of the moved silicon wafer relative to the mask according to the position of the fine alignment mark in the silicon wafer workbench coordinate system and the theoretical position of the fine alignment mark, and moving the silicon wafer according to the second position offset information. According to the method, a model is established accordin |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118519322A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118519322A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118519322A3</originalsourceid><addsrcrecordid>eNrjZHAMzszJTM7PUyhPTEstUkjMyUzPy03NK1HITS3JyE9RSMxLUSjGoaS4srgkNZeHgTUtMac4lRdKczMourmGOHvophbkx6cWFyQmp-allsQ7-xkaWpgaWhobGTkaE6MGAB0JMes</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Silicon wafer alignment method and silicon wafer alignment system</title><source>esp@cenet</source><creator>ZHANG QI ; FU YOUYIN ; DENG LIJUN ; ZHANG MANNI ; LU ZHIMING ; JIA XUAN</creator><creatorcontrib>ZHANG QI ; FU YOUYIN ; DENG LIJUN ; ZHANG MANNI ; LU ZHIMING ; JIA XUAN</creatorcontrib><description>The invention provides a silicon wafer alignment method and a silicon wafer alignment system, and relates to the field of semiconductors. The method comprises the following steps: acquiring a first image of a silicon wafer to determine the position of a coarse alignment mark in a silicon wafer workbench coordinate system, further determining first position offset information of the silicon wafer relative to a mask, and moving the silicon wafer according to the first position offset information; acquiring a second image to determine the position of the fine alignment mark in the silicon wafer workbench coordinate system; and determining second position offset information of the moved silicon wafer relative to the mask according to the position of the fine alignment mark in the silicon wafer workbench coordinate system and the theoretical position of the fine alignment mark, and moving the silicon wafer according to the second position offset information. According to the method, a model is established accordin</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240820&DB=EPODOC&CC=CN&NR=118519322A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240820&DB=EPODOC&CC=CN&NR=118519322A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHANG QI</creatorcontrib><creatorcontrib>FU YOUYIN</creatorcontrib><creatorcontrib>DENG LIJUN</creatorcontrib><creatorcontrib>ZHANG MANNI</creatorcontrib><creatorcontrib>LU ZHIMING</creatorcontrib><creatorcontrib>JIA XUAN</creatorcontrib><title>Silicon wafer alignment method and silicon wafer alignment system</title><description>The invention provides a silicon wafer alignment method and a silicon wafer alignment system, and relates to the field of semiconductors. The method comprises the following steps: acquiring a first image of a silicon wafer to determine the position of a coarse alignment mark in a silicon wafer workbench coordinate system, further determining first position offset information of the silicon wafer relative to a mask, and moving the silicon wafer according to the first position offset information; acquiring a second image to determine the position of the fine alignment mark in the silicon wafer workbench coordinate system; and determining second position offset information of the moved silicon wafer relative to the mask according to the position of the fine alignment mark in the silicon wafer workbench coordinate system and the theoretical position of the fine alignment mark, and moving the silicon wafer according to the second position offset information. According to the method, a model is established accordin</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAMzszJTM7PUyhPTEstUkjMyUzPy03NK1HITS3JyE9RSMxLUSjGoaS4srgkNZeHgTUtMac4lRdKczMourmGOHvophbkx6cWFyQmp-allsQ7-xkaWpgaWhobGTkaE6MGAB0JMes</recordid><startdate>20240820</startdate><enddate>20240820</enddate><creator>ZHANG QI</creator><creator>FU YOUYIN</creator><creator>DENG LIJUN</creator><creator>ZHANG MANNI</creator><creator>LU ZHIMING</creator><creator>JIA XUAN</creator><scope>EVB</scope></search><sort><creationdate>20240820</creationdate><title>Silicon wafer alignment method and silicon wafer alignment system</title><author>ZHANG QI ; FU YOUYIN ; DENG LIJUN ; ZHANG MANNI ; LU ZHIMING ; JIA XUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118519322A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHANG QI</creatorcontrib><creatorcontrib>FU YOUYIN</creatorcontrib><creatorcontrib>DENG LIJUN</creatorcontrib><creatorcontrib>ZHANG MANNI</creatorcontrib><creatorcontrib>LU ZHIMING</creatorcontrib><creatorcontrib>JIA XUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHANG QI</au><au>FU YOUYIN</au><au>DENG LIJUN</au><au>ZHANG MANNI</au><au>LU ZHIMING</au><au>JIA XUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Silicon wafer alignment method and silicon wafer alignment system</title><date>2024-08-20</date><risdate>2024</risdate><abstract>The invention provides a silicon wafer alignment method and a silicon wafer alignment system, and relates to the field of semiconductors. The method comprises the following steps: acquiring a first image of a silicon wafer to determine the position of a coarse alignment mark in a silicon wafer workbench coordinate system, further determining first position offset information of the silicon wafer relative to a mask, and moving the silicon wafer according to the first position offset information; acquiring a second image to determine the position of the fine alignment mark in the silicon wafer workbench coordinate system; and determining second position offset information of the moved silicon wafer relative to the mask according to the position of the fine alignment mark in the silicon wafer workbench coordinate system and the theoretical position of the fine alignment mark, and moving the silicon wafer according to the second position offset information. According to the method, a model is established accordin</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
title | Silicon wafer alignment method and silicon wafer alignment system |
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