Silicon wafer alignment method and silicon wafer alignment system

The invention provides a silicon wafer alignment method and a silicon wafer alignment system, and relates to the field of semiconductors. The method comprises the following steps: acquiring a first image of a silicon wafer to determine the position of a coarse alignment mark in a silicon wafer workb...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHANG QI, FU YOUYIN, DENG LIJUN, ZHANG MANNI, LU ZHIMING, JIA XUAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ZHANG QI
FU YOUYIN
DENG LIJUN
ZHANG MANNI
LU ZHIMING
JIA XUAN
description The invention provides a silicon wafer alignment method and a silicon wafer alignment system, and relates to the field of semiconductors. The method comprises the following steps: acquiring a first image of a silicon wafer to determine the position of a coarse alignment mark in a silicon wafer workbench coordinate system, further determining first position offset information of the silicon wafer relative to a mask, and moving the silicon wafer according to the first position offset information; acquiring a second image to determine the position of the fine alignment mark in the silicon wafer workbench coordinate system; and determining second position offset information of the moved silicon wafer relative to the mask according to the position of the fine alignment mark in the silicon wafer workbench coordinate system and the theoretical position of the fine alignment mark, and moving the silicon wafer according to the second position offset information. According to the method, a model is established accordin
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118519322A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118519322A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118519322A3</originalsourceid><addsrcrecordid>eNrjZHAMzszJTM7PUyhPTEstUkjMyUzPy03NK1HITS3JyE9RSMxLUSjGoaS4srgkNZeHgTUtMac4lRdKczMourmGOHvophbkx6cWFyQmp-allsQ7-xkaWpgaWhobGTkaE6MGAB0JMes</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Silicon wafer alignment method and silicon wafer alignment system</title><source>esp@cenet</source><creator>ZHANG QI ; FU YOUYIN ; DENG LIJUN ; ZHANG MANNI ; LU ZHIMING ; JIA XUAN</creator><creatorcontrib>ZHANG QI ; FU YOUYIN ; DENG LIJUN ; ZHANG MANNI ; LU ZHIMING ; JIA XUAN</creatorcontrib><description>The invention provides a silicon wafer alignment method and a silicon wafer alignment system, and relates to the field of semiconductors. The method comprises the following steps: acquiring a first image of a silicon wafer to determine the position of a coarse alignment mark in a silicon wafer workbench coordinate system, further determining first position offset information of the silicon wafer relative to a mask, and moving the silicon wafer according to the first position offset information; acquiring a second image to determine the position of the fine alignment mark in the silicon wafer workbench coordinate system; and determining second position offset information of the moved silicon wafer relative to the mask according to the position of the fine alignment mark in the silicon wafer workbench coordinate system and the theoretical position of the fine alignment mark, and moving the silicon wafer according to the second position offset information. According to the method, a model is established accordin</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240820&amp;DB=EPODOC&amp;CC=CN&amp;NR=118519322A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240820&amp;DB=EPODOC&amp;CC=CN&amp;NR=118519322A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHANG QI</creatorcontrib><creatorcontrib>FU YOUYIN</creatorcontrib><creatorcontrib>DENG LIJUN</creatorcontrib><creatorcontrib>ZHANG MANNI</creatorcontrib><creatorcontrib>LU ZHIMING</creatorcontrib><creatorcontrib>JIA XUAN</creatorcontrib><title>Silicon wafer alignment method and silicon wafer alignment system</title><description>The invention provides a silicon wafer alignment method and a silicon wafer alignment system, and relates to the field of semiconductors. The method comprises the following steps: acquiring a first image of a silicon wafer to determine the position of a coarse alignment mark in a silicon wafer workbench coordinate system, further determining first position offset information of the silicon wafer relative to a mask, and moving the silicon wafer according to the first position offset information; acquiring a second image to determine the position of the fine alignment mark in the silicon wafer workbench coordinate system; and determining second position offset information of the moved silicon wafer relative to the mask according to the position of the fine alignment mark in the silicon wafer workbench coordinate system and the theoretical position of the fine alignment mark, and moving the silicon wafer according to the second position offset information. According to the method, a model is established accordin</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAMzszJTM7PUyhPTEstUkjMyUzPy03NK1HITS3JyE9RSMxLUSjGoaS4srgkNZeHgTUtMac4lRdKczMourmGOHvophbkx6cWFyQmp-allsQ7-xkaWpgaWhobGTkaE6MGAB0JMes</recordid><startdate>20240820</startdate><enddate>20240820</enddate><creator>ZHANG QI</creator><creator>FU YOUYIN</creator><creator>DENG LIJUN</creator><creator>ZHANG MANNI</creator><creator>LU ZHIMING</creator><creator>JIA XUAN</creator><scope>EVB</scope></search><sort><creationdate>20240820</creationdate><title>Silicon wafer alignment method and silicon wafer alignment system</title><author>ZHANG QI ; FU YOUYIN ; DENG LIJUN ; ZHANG MANNI ; LU ZHIMING ; JIA XUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118519322A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHANG QI</creatorcontrib><creatorcontrib>FU YOUYIN</creatorcontrib><creatorcontrib>DENG LIJUN</creatorcontrib><creatorcontrib>ZHANG MANNI</creatorcontrib><creatorcontrib>LU ZHIMING</creatorcontrib><creatorcontrib>JIA XUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHANG QI</au><au>FU YOUYIN</au><au>DENG LIJUN</au><au>ZHANG MANNI</au><au>LU ZHIMING</au><au>JIA XUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Silicon wafer alignment method and silicon wafer alignment system</title><date>2024-08-20</date><risdate>2024</risdate><abstract>The invention provides a silicon wafer alignment method and a silicon wafer alignment system, and relates to the field of semiconductors. The method comprises the following steps: acquiring a first image of a silicon wafer to determine the position of a coarse alignment mark in a silicon wafer workbench coordinate system, further determining first position offset information of the silicon wafer relative to a mask, and moving the silicon wafer according to the first position offset information; acquiring a second image to determine the position of the fine alignment mark in the silicon wafer workbench coordinate system; and determining second position offset information of the moved silicon wafer relative to the mask according to the position of the fine alignment mark in the silicon wafer workbench coordinate system and the theoretical position of the fine alignment mark, and moving the silicon wafer according to the second position offset information. According to the method, a model is established accordin</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN118519322A
source esp@cenet
subjects APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
title Silicon wafer alignment method and silicon wafer alignment system
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-13T23%3A57%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZHANG%20QI&rft.date=2024-08-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN118519322A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true