Silicon wafer alignment method and silicon wafer alignment system
The invention provides a silicon wafer alignment method and a silicon wafer alignment system, and relates to the field of semiconductors. The method comprises the following steps: acquiring a first image of a silicon wafer to determine the position of a coarse alignment mark in a silicon wafer workb...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a silicon wafer alignment method and a silicon wafer alignment system, and relates to the field of semiconductors. The method comprises the following steps: acquiring a first image of a silicon wafer to determine the position of a coarse alignment mark in a silicon wafer workbench coordinate system, further determining first position offset information of the silicon wafer relative to a mask, and moving the silicon wafer according to the first position offset information; acquiring a second image to determine the position of the fine alignment mark in the silicon wafer workbench coordinate system; and determining second position offset information of the moved silicon wafer relative to the mask according to the position of the fine alignment mark in the silicon wafer workbench coordinate system and the theoretical position of the fine alignment mark, and moving the silicon wafer according to the second position offset information. According to the method, a model is established accordin |
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