Lead bonding structure of OLED micro display screen

Lead bonding structure of OLED micro display screen

The invention discloses a lead bonding structure of an OLED (Organic Light Emitting Diode) miniature display screen, which is used for electrically connecting the OLED miniature display screen with a circuit board, and comprises the OLED miniature display screen, a lead bonding structure, a lead bon...

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Hauptverfasser: LI MUCI, SUN HAO, HUANG HAIJUN
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LI MUCI
SUN HAO
HUANG HAIJUN
description The invention discloses a lead bonding structure of an OLED (Organic Light Emitting Diode) miniature display screen, which is used for electrically connecting the OLED miniature display screen with a circuit board, and comprises the OLED miniature display screen, a lead bonding structure, a lead bonding structure and a lead bonding structure, and is characterized in that the OLED miniature display screen is provided with a plurality of pins and an IC (Integrated Circuit); the circuit board is provided with bonding pads with the same quantity as the pins; a lead; an insulating sealant; the OLED micro display screen is bonded on the circuit board, a bonding pad on the circuit board and a pin on the OLED micro display screen are arranged on the same side, and the bonding pad on the circuit board is arranged in a single row; one end of each lead wire is connected with the bonding pad, the other end of each lead wire is connected with the pin, the projections of two adjacent lead wires in the vertical direction ar
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Lead bonding structure of OLED micro display screen
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