Manufacturing method of laser module and laser module tube shell
The invention provides a manufacturing method of a laser module and a laser module tube shell, and relates to the technical field of laser modules, the laser module comprises the laser module tube shell and a chip arranged in the laser module tube shell, the laser module tube shell comprises a tube...
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creator | CHEN SHANJIE ZUO FANG CHEN SHULING SUN HAIDONG |
description | The invention provides a manufacturing method of a laser module and a laser module tube shell, and relates to the technical field of laser modules, the laser module comprises the laser module tube shell and a chip arranged in the laser module tube shell, the laser module tube shell comprises a tube shell main body and a bonding pad, the tube shell main body comprises a tube shell bottom and a glass window sheet which are oppositely arranged, and the bonding pad is arranged in the tube shell main body. The tube shell bottom and the tube shell wall are connected, the material of the tube shell bottom comprises one of aluminum nitride ceramic, silicon carbide ceramic and diamond, and the material of the tube shell wall comprises aluminum nitride ceramic or aluminum oxide ceramic; the manufacturing method of the laser module comprises the following steps that the chip and the heat sink are welded into a whole through gold-tin solder; connecting an electrode on the chip with the bonding pad and fixing the chip at |
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The tube shell bottom and the tube shell wall are connected, the material of the tube shell bottom comprises one of aluminum nitride ceramic, silicon carbide ceramic and diamond, and the material of the tube shell wall comprises aluminum nitride ceramic or aluminum oxide ceramic; the manufacturing method of the laser module comprises the following steps that the chip and the heat sink are welded into a whole through gold-tin solder; connecting an electrode on the chip with the bonding pad and fixing the chip at</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRICITY</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240813&DB=EPODOC&CC=CN&NR=118487103A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76292</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240813&DB=EPODOC&CC=CN&NR=118487103A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN SHANJIE</creatorcontrib><creatorcontrib>ZUO FANG</creatorcontrib><creatorcontrib>CHEN SHULING</creatorcontrib><creatorcontrib>SUN HAIDONG</creatorcontrib><title>Manufacturing method of laser module and laser module tube shell</title><description>The invention provides a manufacturing method of a laser module and a laser module tube shell, and relates to the technical field of laser modules, the laser module comprises the laser module tube shell and a chip arranged in the laser module tube shell, the laser module tube shell comprises a tube shell main body and a bonding pad, the tube shell main body comprises a tube shell bottom and a glass window sheet which are oppositely arranged, and the bonding pad is arranged in the tube shell main body. 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The tube shell bottom and the tube shell wall are connected, the material of the tube shell bottom comprises one of aluminum nitride ceramic, silicon carbide ceramic and diamond, and the material of the tube shell wall comprises aluminum nitride ceramic or aluminum oxide ceramic; the manufacturing method of the laser module comprises the following steps that the chip and the heat sink are welded into a whole through gold-tin solder; connecting an electrode on the chip with the bonding pad and fixing the chip at</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRICITY |
title | Manufacturing method of laser module and laser module tube shell |
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