Molding device with wedge-shaped drive
The molding equipment comprises a mold and a wedge-shaped structure. The mold is provided with a first mold component and a second mold component, the second mold component is configured to be capable of moving towards the first mold component in the first direction, and the first mold component and...
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| creator | LI KAIYAO KUAH TENG HOCK CHEN JIANJUN HAO JIYUAN LIN YI |
| description | The molding equipment comprises a mold and a wedge-shaped structure. The mold is provided with a first mold component and a second mold component, the second mold component is configured to be capable of moving towards the first mold component in the first direction, and the first mold component and the second mold component are matched to form a molding cavity used for packaging the electronic component in use. The wedge structure has a first wedge member attached to the second mold member and a second wedge member configured to be in contact with the first wedge member and movable in a second direction perpendicular to the first direction, and a second wedge-shaped member to adjust a contact portion between a first contact surface of the first wedge-shaped member and a second contact surface of the second wedge-shaped member to bias the second mold member toward the first mold member to form a mold cavity, where at least one of the first contact surface and the second contact surface includes a first protec |
| format | Patent |
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The mold is provided with a first mold component and a second mold component, the second mold component is configured to be capable of moving towards the first mold component in the first direction, and the first mold component and the second mold component are matched to form a molding cavity used for packaging the electronic component in use. The wedge structure has a first wedge member attached to the second mold member and a second wedge member configured to be in contact with the first wedge member and movable in a second direction perpendicular to the first direction, and a second wedge-shaped member to adjust a contact portion between a first contact surface of the first wedge-shaped member and a second contact surface of the second wedge-shaped member to bias the second mold member toward the first mold member to form a mold cavity, where at least one of the first contact surface and the second contact surface includes a first protec</description><language>chi ; eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240809&DB=EPODOC&CC=CN&NR=118471835A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240809&DB=EPODOC&CC=CN&NR=118471835A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI KAIYAO</creatorcontrib><creatorcontrib>KUAH TENG HOCK</creatorcontrib><creatorcontrib>CHEN JIANJUN</creatorcontrib><creatorcontrib>HAO JIYUAN</creatorcontrib><creatorcontrib>LIN YI</creatorcontrib><title>Molding device with wedge-shaped drive</title><description>The molding equipment comprises a mold and a wedge-shaped structure. The mold is provided with a first mold component and a second mold component, the second mold component is configured to be capable of moving towards the first mold component in the first direction, and the first mold component and the second mold component are matched to form a molding cavity used for packaging the electronic component in use. 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The mold is provided with a first mold component and a second mold component, the second mold component is configured to be capable of moving towards the first mold component in the first direction, and the first mold component and the second mold component are matched to form a molding cavity used for packaging the electronic component in use. The wedge structure has a first wedge member attached to the second mold member and a second wedge member configured to be in contact with the first wedge member and movable in a second direction perpendicular to the first direction, and a second wedge-shaped member to adjust a contact portion between a first contact surface of the first wedge-shaped member and a second contact surface of the second wedge-shaped member to bias the second mold member toward the first mold member to form a mold cavity, where at least one of the first contact surface and the second contact surface includes a first protec</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Molding device with wedge-shaped drive |
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