Manufacturing method of printed circuit board with embedded copper block and printed circuit board
The invention provides a manufacturing method of a printed circuit board with embedded copper blocks and the printed circuit board. The method comprises the following steps: acquiring a substrate and a copper block of the circuit board; grooving the substrate of the circuit board to obtain a substra...
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| creator | LIU ZHIHUA LIU XIAOPING LONG JUANJUAN WANG ZHENXING |
| description | The invention provides a manufacturing method of a printed circuit board with embedded copper blocks and the printed circuit board. The method comprises the following steps: acquiring a substrate and a copper block of the circuit board; grooving the substrate of the circuit board to obtain a substrate with a buried copper groove; carrying out etching treatment on the copper block to obtain a copper block with a circuit; obtaining a substrate with a copper block according to the substrate with the copper burying groove and the copper block with the circuit; and pressing the substrate with the copper block to obtain the printed circuit board embedded with the copper block. The manufacturing method provided by the invention not only can improve the binding force between the copper block and the substrate and the qualified rate of the printed circuit board, but also can effectively remove the residual glue and ensure the conductivity of the circuit.
本发明提供一种埋嵌铜块的印制电路板的制作方法及印制电路板。所述方法包括：获取电路板的基板、铜块；对所述电路板的基板进行开槽处理， |
| format | Patent |
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本发明提供一种埋嵌铜块的印制电路板的制作方法及印制电路板。所述方法包括：获取电路板的基板、铜块；对所述电路板的基板进行开槽处理，</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240802&DB=EPODOC&CC=CN&NR=118434015A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240802&DB=EPODOC&CC=CN&NR=118434015A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU ZHIHUA</creatorcontrib><creatorcontrib>LIU XIAOPING</creatorcontrib><creatorcontrib>LONG JUANJUAN</creatorcontrib><creatorcontrib>WANG ZHENXING</creatorcontrib><title>Manufacturing method of printed circuit board with embedded copper block and printed circuit board</title><description>The invention provides a manufacturing method of a printed circuit board with embedded copper blocks and the printed circuit board. The method comprises the following steps: acquiring a substrate and a copper block of the circuit board; grooving the substrate of the circuit board to obtain a substrate with a buried copper groove; carrying out etching treatment on the copper block to obtain a copper block with a circuit; obtaining a substrate with a copper block according to the substrate with the copper burying groove and the copper block with the circuit; and pressing the substrate with the copper block to obtain the printed circuit board embedded with the copper block. The manufacturing method provided by the invention not only can improve the binding force between the copper block and the substrate and the qualified rate of the printed circuit board, but also can effectively remove the residual glue and ensure the conductivity of the circuit.
本发明提供一种埋嵌铜块的印制电路板的制作方法及印制电路板。所述方法包括：获取电路板的基板、铜块；对所述电路板的基板进行开槽处理，</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi7EKwjAQhrs4iPoO5wMIhlZwlaK46OReLrmLDba5kF7w9VVwdHD6-fi-f17ZC8bi0WnJId5hZO2FQDykNysTuJBdCQpWMBM8g_bAo2Wij5OUOIMdxD0AI_0-LauZx2Hi1XcX1fp0vLXnDSfpeEroOLJ27dWYfVM3W7M71P80L2dVPhg</recordid><startdate>20240802</startdate><enddate>20240802</enddate><creator>LIU ZHIHUA</creator><creator>LIU XIAOPING</creator><creator>LONG JUANJUAN</creator><creator>WANG ZHENXING</creator><scope>EVB</scope></search><sort><creationdate>20240802</creationdate><title>Manufacturing method of printed circuit board with embedded copper block and printed circuit board</title><author>LIU ZHIHUA ; LIU XIAOPING ; LONG JUANJUAN ; WANG ZHENXING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118434015A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU ZHIHUA</creatorcontrib><creatorcontrib>LIU XIAOPING</creatorcontrib><creatorcontrib>LONG JUANJUAN</creatorcontrib><creatorcontrib>WANG ZHENXING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU ZHIHUA</au><au>LIU XIAOPING</au><au>LONG JUANJUAN</au><au>WANG ZHENXING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Manufacturing method of printed circuit board with embedded copper block and printed circuit board</title><date>2024-08-02</date><risdate>2024</risdate><abstract>The invention provides a manufacturing method of a printed circuit board with embedded copper blocks and the printed circuit board. The method comprises the following steps: acquiring a substrate and a copper block of the circuit board; grooving the substrate of the circuit board to obtain a substrate with a buried copper groove; carrying out etching treatment on the copper block to obtain a copper block with a circuit; obtaining a substrate with a copper block according to the substrate with the copper burying groove and the copper block with the circuit; and pressing the substrate with the copper block to obtain the printed circuit board embedded with the copper block. The manufacturing method provided by the invention not only can improve the binding force between the copper block and the substrate and the qualified rate of the printed circuit board, but also can effectively remove the residual glue and ensure the conductivity of the circuit.
本发明提供一种埋嵌铜块的印制电路板的制作方法及印制电路板。所述方法包括：获取电路板的基板、铜块；对所述电路板的基板进行开槽处理，</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Manufacturing method of printed circuit board with embedded copper block and printed circuit board |
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