Multilayer ceramic circuit board and preparation method thereof
The invention discloses a method for preparing a multilayer ceramic circuit board, which belongs to the technical field of microelectronic packaging, and comprises the following steps of: preparing an electroplated ceramic substrate (DPC) with a surface circuit layer, a metal microstructure and a ve...
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| creator | LIU XUECHANG LIU SONGPO ZHANG SHUQIANG |
| description | The invention discloses a method for preparing a multilayer ceramic circuit board, which belongs to the technical field of microelectronic packaging, and comprises the following steps of: preparing an electroplated ceramic substrate (DPC) with a surface circuit layer, a metal microstructure and a vertical through hole copper column through a pattern electroplating process; then fine grinding and leveling are conducted on the DPC ceramic substrate metal microstructure through a high-speed rotary cutting method; and then the DPC ceramic substrates are positioned, so that the metal microstructures after rotary cutting are mutually aligned, the metal layers are directly bonded through heating and pressurizing, mechanical connection and electrical interconnection between the DPC ceramic substrates are realized, and thus the multilayer ceramic circuit board is obtained. According to the method, the surface of the metal layer is leveled by using the fine grinding characteristic of the rotary cutting process, so that |
| format | Patent |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Multilayer ceramic circuit board and preparation method thereof |
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