Depth information camera module and 3D sensing device
The invention discloses a depth information camera module and a 3D sensing device, the depth information camera module comprises a packaging main body, a driving chip and a light source chip, the packaging main body is provided with a projection end, a circuit board is arranged in the projection end...
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| creator | HU GUOQUAN WANG YANGRONG XIONG SHI ZHANG XUE LU PENG JIANG WEIJIE WENREN LIANGJIE |
| description | The invention discloses a depth information camera module and a 3D sensing device, the depth information camera module comprises a packaging main body, a driving chip and a light source chip, the packaging main body is provided with a projection end, a circuit board is arranged in the projection end, the driving chip is coated with a packaging substrate, the packaging substrate and the light source chip are sequentially stacked on the side, close to an object, of the circuit board, and the light source chip is arranged in the packaging main body. The driving chip and the light source chip are connected through a plurality of first conductive circuits, the driving chip and the circuit board are connected through a second conductive circuit, the light source chip and the circuit board are connected through a third conductive circuit, and the length of the first conductive circuits is smaller than that of the second conductive circuit. The length of the first conductive circuit is smaller than that of the third |
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The driving chip and the light source chip are connected through a plurality of first conductive circuits, the driving chip and the circuit board are connected through a second conductive circuit, the light source chip and the circuit board are connected through a third conductive circuit, and the length of the first conductive circuits is smaller than that of the second conductive circuit. 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The driving chip and the light source chip are connected through a plurality of first conductive circuits, the driving chip and the circuit board are connected through a second conductive circuit, the light source chip and the circuit board are connected through a third conductive circuit, and the length of the first conductive circuits is smaller than that of the second conductive circuit. The length of the first conductive circuit is smaller than that of the third</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ANALOGOUS ARRANGEMENTS USING OTHER WAVES BASIC ELECTRIC ELEMENTS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES DEVICES USING STIMULATED EMISSION ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION RADIO DIRECTION-FINDING RADIO NAVIGATION TESTING |
| title | Depth information camera module and 3D sensing device |
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