Bonder BTO calibration method based on automatic identification

The invention provides a bonding machine BTO calibration method based on automatic identification, and relates to the field of bonding machine BTO calibration. The bonding machine BTO calibration method based on automatic identification comprises the following steps: S1, identifying the same glass m...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAN XIANGYI, SHANG MEIJIE, YAO KANG, LI JINTAO, JING JING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL PHYSICS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!