SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
The invention provides a substrate processing apparatus, a substrate processing method, a method of manufacturing a semiconductor device, and a recording medium, which can improve the uniformity of heating of a substrate in heat treatment using electromagnetic waves. The substrate processing apparat...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | YAMAMOTO KATSUHIKO TAKEBAYASHI MOTONARI SAKANO ATSUYA NABETA KAZUYA |
| description | The invention provides a substrate processing apparatus, a substrate processing method, a method of manufacturing a semiconductor device, and a recording medium, which can improve the uniformity of heating of a substrate in heat treatment using electromagnetic waves. The substrate processing apparatus includes: a processing chamber that processes a substrate; an electromagnetic wave source that simultaneously outputs at least a portion of a first electromagnetic wave and a second electromagnetic wave to the processing chamber; and a frequency control unit configured so as to be able to control the frequency of at least one of the first electromagnetic wave and the second electromagnetic wave.
本发明提供一种基板处理装置、基板处理方法、半导体装置的制造方法以及记录介质，能够改善使用电磁波的热处理中的对基板的加热的均匀性。基板处理装置具有：处理室，其对基板进行处理；电磁波源，其将第一电磁波和第二电磁波至少一部分同时输出至所述处理室；以及频率控制部，其构成为能够控制所述第一电磁波和所述第二电磁波中的至少一方的频率。 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118352267A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118352267A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118352267A3</originalsourceid><addsrcrecordid>eNqNjDsOwjAQBdNQIOAOS2-KJOLTLusNcWE78oc2ipCpEEQKB-DoBJGSgmqkN6M3z14-Hn1wGBgaZ4m9V-YE2DQ4btEL-Ok1h9pKMREq60CjiRVSiO4TeNaKrJGRwugknxWxADQSHJN18nsiVdTLbHbtbkNaTVxk64oD1ZvUP9o09N0l3dOzJZPnh3JbFLs9lv80b9j8PLM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM</title><source>esp@cenet</source><creator>YAMAMOTO KATSUHIKO ; TAKEBAYASHI MOTONARI ; SAKANO ATSUYA ; NABETA KAZUYA</creator><creatorcontrib>YAMAMOTO KATSUHIKO ; TAKEBAYASHI MOTONARI ; SAKANO ATSUYA ; NABETA KAZUYA</creatorcontrib><description>The invention provides a substrate processing apparatus, a substrate processing method, a method of manufacturing a semiconductor device, and a recording medium, which can improve the uniformity of heating of a substrate in heat treatment using electromagnetic waves. The substrate processing apparatus includes: a processing chamber that processes a substrate; an electromagnetic wave source that simultaneously outputs at least a portion of a first electromagnetic wave and a second electromagnetic wave to the processing chamber; and a frequency control unit configured so as to be able to control the frequency of at least one of the first electromagnetic wave and the second electromagnetic wave.
本发明提供一种基板处理装置、基板处理方法、半导体装置的制造方法以及记录介质，能够改善使用电磁波的热处理中的对基板的加热的均匀性。基板处理装置具有：处理室，其对基板进行处理；电磁波源，其将第一电磁波和第二电磁波至少一部分同时输出至所述处理室；以及频率控制部，其构成为能够控制所述第一电磁波和所述第二电磁波中的至少一方的频率。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240716&DB=EPODOC&CC=CN&NR=118352267A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240716&DB=EPODOC&CC=CN&NR=118352267A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMAMOTO KATSUHIKO</creatorcontrib><creatorcontrib>TAKEBAYASHI MOTONARI</creatorcontrib><creatorcontrib>SAKANO ATSUYA</creatorcontrib><creatorcontrib>NABETA KAZUYA</creatorcontrib><title>SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM</title><description>The invention provides a substrate processing apparatus, a substrate processing method, a method of manufacturing a semiconductor device, and a recording medium, which can improve the uniformity of heating of a substrate in heat treatment using electromagnetic waves. The substrate processing apparatus includes: a processing chamber that processes a substrate; an electromagnetic wave source that simultaneously outputs at least a portion of a first electromagnetic wave and a second electromagnetic wave to the processing chamber; and a frequency control unit configured so as to be able to control the frequency of at least one of the first electromagnetic wave and the second electromagnetic wave.
本发明提供一种基板处理装置、基板处理方法、半导体装置的制造方法以及记录介质，能够改善使用电磁波的热处理中的对基板的加热的均匀性。基板处理装置具有：处理室，其对基板进行处理；电磁波源，其将第一电磁波和第二电磁波至少一部分同时输出至所述处理室；以及频率控制部，其构成为能够控制所述第一电磁波和所述第二电磁波中的至少一方的频率。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDsOwjAQBdNQIOAOS2-KJOLTLusNcWE78oc2ipCpEEQKB-DoBJGSgmqkN6M3z14-Hn1wGBgaZ4m9V-YE2DQ4btEL-Ok1h9pKMREq60CjiRVSiO4TeNaKrJGRwugknxWxADQSHJN18nsiVdTLbHbtbkNaTVxk64oD1ZvUP9o09N0l3dOzJZPnh3JbFLs9lv80b9j8PLM</recordid><startdate>20240716</startdate><enddate>20240716</enddate><creator>YAMAMOTO KATSUHIKO</creator><creator>TAKEBAYASHI MOTONARI</creator><creator>SAKANO ATSUYA</creator><creator>NABETA KAZUYA</creator><scope>EVB</scope></search><sort><creationdate>20240716</creationdate><title>SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM</title><author>YAMAMOTO KATSUHIKO ; TAKEBAYASHI MOTONARI ; SAKANO ATSUYA ; NABETA KAZUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118352267A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMAMOTO KATSUHIKO</creatorcontrib><creatorcontrib>TAKEBAYASHI MOTONARI</creatorcontrib><creatorcontrib>SAKANO ATSUYA</creatorcontrib><creatorcontrib>NABETA KAZUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMAMOTO KATSUHIKO</au><au>TAKEBAYASHI MOTONARI</au><au>SAKANO ATSUYA</au><au>NABETA KAZUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM</title><date>2024-07-16</date><risdate>2024</risdate><abstract>The invention provides a substrate processing apparatus, a substrate processing method, a method of manufacturing a semiconductor device, and a recording medium, which can improve the uniformity of heating of a substrate in heat treatment using electromagnetic waves. The substrate processing apparatus includes: a processing chamber that processes a substrate; an electromagnetic wave source that simultaneously outputs at least a portion of a first electromagnetic wave and a second electromagnetic wave to the processing chamber; and a frequency control unit configured so as to be able to control the frequency of at least one of the first electromagnetic wave and the second electromagnetic wave.
本发明提供一种基板处理装置、基板处理方法、半导体装置的制造方法以及记录介质，能够改善使用电磁波的热处理中的对基板的加热的均匀性。基板处理装置具有：处理室，其对基板进行处理；电磁波源，其将第一电磁波和第二电磁波至少一部分同时输出至所述处理室；以及频率控制部，其构成为能够控制所述第一电磁波和所述第二电磁波中的至少一方的频率。</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN118352267A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T17%3A58%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YAMAMOTO%20KATSUHIKO&rft.date=2024-07-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN118352267A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |