Carrier plate for packaging semiconductor chip

Carrier plate for packaging semiconductor chip

The invention relates to the technical field of chip packaging, and discloses a carrier disc for semiconductor chip packaging, which comprises an operation table, a chip body is placed on the upper surface of the operation table, a rotating rod is rotatably connected to the lower surface of the oper...

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Hauptverfasser: ZHANG CHUNXIA, LI FANXING, LI BEIYIN, SHEN HONGXING
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator ZHANG CHUNXIA
LI FANXING
LI BEIYIN
SHEN HONGXING
description The invention relates to the technical field of chip packaging, and discloses a carrier disc for semiconductor chip packaging, which comprises an operation table, a chip body is placed on the upper surface of the operation table, a rotating rod is rotatably connected to the lower surface of the operation table, and symmetrical sliding plates are slidably connected to the lower surface of the operation table. Connecting rods are rotationally connected between the two sliding plates and the rotating rod, the ends of the two connecting rods are rotationally connected to the lower surfaces of the two ends of the rotating rod, symmetrical vertical rods are arranged on the upper surfaces of the sliding plates, and transverse rods are arranged on one faces of the vertical rods. The side face of the end, away from the vertical rod, of the transverse rod is rotationally connected with an L-shaped righting frame, the side faces of the two ends of the righting frame are rotationally connected with elastic wheels, and a
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Carrier plate for packaging semiconductor chip
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