Method for reducing mechanical coupling error of quartz sensing device

The invention relates to the technical field of quartz sensing device preparation, in particular to a method for reducing the mechanical coupling error of a quartz sensing device, which comprises the following steps: processing a Z-cut quartz wafer to form a plurality of quartz sensor chips to obtai...

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Hauptverfasser: RUAN XIANGYU, ZHONG YUANHUA, XIONG FENG, ZHAN CHAO, LIAO XIANG
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Sprache:chi ; eng
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creator RUAN XIANGYU
ZHONG YUANHUA
XIONG FENG
ZHAN CHAO
LIAO XIANG
description The invention relates to the technical field of quartz sensing device preparation, in particular to a method for reducing the mechanical coupling error of a quartz sensing device, which comprises the following steps: processing a Z-cut quartz wafer to form a plurality of quartz sensor chips to obtain a quartz sensor wafer, the side wall of each quartz sensor chip being provided with a crystal edge; coating the quartz sensor wafer to form a first metal film layer; forming a first photoresist on the surface of the first metal film layer; exposing the first photoresist of the crystal edge through a side exposure method; transferring the exposure pattern of the first photoresist to the first metal film layer to obtain an exposed crystal edge; exposed crystal edges are eliminated through a quartz wet chemical corrosion method. The method has the effects of accurately eliminating the crystal edge on the side wall of the quartz sensor chip through fixed-point positioning and reducing the mechanical coupling error of
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118306945A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118306945A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118306945A3</originalsourceid><addsrcrecordid>eNrjZHDzTS3JyE9RSMsvUihKTSlNzsxLV8hNTc5IzMtMTsxRSM4vLcgBiaUWFQGV5KcpFJYmFpVUKRSn5hWDxFNSyzKTU3kYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyzn6GhhbGBmaWJqaMxMWoAPsMzww</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for reducing mechanical coupling error of quartz sensing device</title><source>esp@cenet</source><creator>RUAN XIANGYU ; ZHONG YUANHUA ; XIONG FENG ; ZHAN CHAO ; LIAO XIANG</creator><creatorcontrib>RUAN XIANGYU ; ZHONG YUANHUA ; XIONG FENG ; ZHAN CHAO ; LIAO XIANG</creatorcontrib><description>The invention relates to the technical field of quartz sensing device preparation, in particular to a method for reducing the mechanical coupling error of a quartz sensing device, which comprises the following steps: processing a Z-cut quartz wafer to form a plurality of quartz sensor chips to obtain a quartz sensor wafer, the side wall of each quartz sensor chip being provided with a crystal edge; coating the quartz sensor wafer to form a first metal film layer; forming a first photoresist on the surface of the first metal film layer; exposing the first photoresist of the crystal edge through a side exposure method; transferring the exposure pattern of the first photoresist to the first metal film layer to obtain an exposed crystal edge; exposed crystal edges are eliminated through a quartz wet chemical corrosion method. The method has the effects of accurately eliminating the crystal edge on the side wall of the quartz sensor chip through fixed-point positioning and reducing the mechanical coupling error of</description><language>chi ; eng</language><subject>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS ; MEASURING ; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE ; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PHYSICS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; TARIFF METERING APPARATUS ; TESTING ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240709&amp;DB=EPODOC&amp;CC=CN&amp;NR=118306945A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240709&amp;DB=EPODOC&amp;CC=CN&amp;NR=118306945A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RUAN XIANGYU</creatorcontrib><creatorcontrib>ZHONG YUANHUA</creatorcontrib><creatorcontrib>XIONG FENG</creatorcontrib><creatorcontrib>ZHAN CHAO</creatorcontrib><creatorcontrib>LIAO XIANG</creatorcontrib><title>Method for reducing mechanical coupling error of quartz sensing device</title><description>The invention relates to the technical field of quartz sensing device preparation, in particular to a method for reducing the mechanical coupling error of a quartz sensing device, which comprises the following steps: processing a Z-cut quartz wafer to form a plurality of quartz sensor chips to obtain a quartz sensor wafer, the side wall of each quartz sensor chip being provided with a crystal edge; coating the quartz sensor wafer to form a first metal film layer; forming a first photoresist on the surface of the first metal film layer; exposing the first photoresist of the crystal edge through a side exposure method; transferring the exposure pattern of the first photoresist to the first metal film layer to obtain an exposed crystal edge; exposed crystal edges are eliminated through a quartz wet chemical corrosion method. The method has the effects of accurately eliminating the crystal edge on the side wall of the quartz sensor chip through fixed-point positioning and reducing the mechanical coupling error of</description><subject>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS</subject><subject>MEASURING</subject><subject>MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE</subject><subject>MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>TARIFF METERING APPARATUS</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDzTS3JyE9RSMsvUihKTSlNzsxLV8hNTc5IzMtMTsxRSM4vLcgBiaUWFQGV5KcpFJYmFpVUKRSn5hWDxFNSyzKTU3kYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyzn6GhhbGBmaWJqaMxMWoAPsMzww</recordid><startdate>20240709</startdate><enddate>20240709</enddate><creator>RUAN XIANGYU</creator><creator>ZHONG YUANHUA</creator><creator>XIONG FENG</creator><creator>ZHAN CHAO</creator><creator>LIAO XIANG</creator><scope>EVB</scope></search><sort><creationdate>20240709</creationdate><title>Method for reducing mechanical coupling error of quartz sensing device</title><author>RUAN XIANGYU ; ZHONG YUANHUA ; XIONG FENG ; ZHAN CHAO ; LIAO XIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118306945A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS</topic><topic>MEASURING</topic><topic>MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE</topic><topic>MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>TARIFF METERING APPARATUS</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>RUAN XIANGYU</creatorcontrib><creatorcontrib>ZHONG YUANHUA</creatorcontrib><creatorcontrib>XIONG FENG</creatorcontrib><creatorcontrib>ZHAN CHAO</creatorcontrib><creatorcontrib>LIAO XIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RUAN XIANGYU</au><au>ZHONG YUANHUA</au><au>XIONG FENG</au><au>ZHAN CHAO</au><au>LIAO XIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for reducing mechanical coupling error of quartz sensing device</title><date>2024-07-09</date><risdate>2024</risdate><abstract>The invention relates to the technical field of quartz sensing device preparation, in particular to a method for reducing the mechanical coupling error of a quartz sensing device, which comprises the following steps: processing a Z-cut quartz wafer to form a plurality of quartz sensor chips to obtain a quartz sensor wafer, the side wall of each quartz sensor chip being provided with a crystal edge; coating the quartz sensor wafer to form a first metal film layer; forming a first photoresist on the surface of the first metal film layer; exposing the first photoresist of the crystal edge through a side exposure method; transferring the exposure pattern of the first photoresist to the first metal film layer to obtain an exposed crystal edge; exposed crystal edges are eliminated through a quartz wet chemical corrosion method. The method has the effects of accurately eliminating the crystal edge on the side wall of the quartz sensor chip through fixed-point positioning and reducing the mechanical coupling error of</abstract><oa>free_for_read</oa></addata></record>
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subjects ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS
MEASURING
MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE
MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PHYSICS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TARIFF METERING APPARATUS
TESTING
TRANSPORTING
title Method for reducing mechanical coupling error of quartz sensing device
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