Preparation method of semiconductor structure

According to the preparation method of the semiconductor structure provided by the invention, the dry film is used as the dielectric layer, the metal seed layer is formed on the surface of the groove in the dry film through chemical plating, and then the metal layer is formed through electroplating,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YIN JIASHAN, WANG XIAO, XUE XINGTAO, ZHOU ZUYUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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