Cooling and heat dissipation system of ship electric cabinet
A cooling and heat dissipation system of a ship electric cabinet comprises a connecting plate, a semiconductor chilling plate, a heat insulation pad, a heat absorption radiator and a heat release radiator, the connecting plate is provided with a through hole corresponding to the semiconductor chilli...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | MA JIXIAN WANG CHANGBAO LING YOULIN JING GUOLIANG |
description | A cooling and heat dissipation system of a ship electric cabinet comprises a connecting plate, a semiconductor chilling plate, a heat insulation pad, a heat absorption radiator and a heat release radiator, the connecting plate is provided with a through hole corresponding to the semiconductor chilling plate in shape, and the connecting plate is connected with the heat release radiator through an elastic connecting device; a semiconductor chilling plate is arranged at the rear part of the through hole, and the hot end of the semiconductor chilling plate is attached to the heat-releasing radiator; the cold end is connected with the heat-conducting block and the heat-absorbing radiator; a heat insulation pad is arranged between the connecting plate and the heat absorption radiator; the connecting plate is fixedly connected with the heat absorption radiator; a protective cover is arranged outside the heat absorption radiator; a water collecting tank is arranged below the lower cover plate; a fan is arranged on a |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118265270A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118265270A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118265270A3</originalsourceid><addsrcrecordid>eNrjZLBxzs_PycxLV0jMS1HISE0sUUjJLC7OLEgsyczPUyiuLC5JzVXIT1MozsgsUEjNSU0uKcpMVkhOTMrMSy3hYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyalAVfHOfoaGFkZmpkbmBo7GxKgBANxaL7k</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Cooling and heat dissipation system of ship electric cabinet</title><source>esp@cenet</source><creator>MA JIXIAN ; WANG CHANGBAO ; LING YOULIN ; JING GUOLIANG</creator><creatorcontrib>MA JIXIAN ; WANG CHANGBAO ; LING YOULIN ; JING GUOLIANG</creatorcontrib><description>A cooling and heat dissipation system of a ship electric cabinet comprises a connecting plate, a semiconductor chilling plate, a heat insulation pad, a heat absorption radiator and a heat release radiator, the connecting plate is provided with a through hole corresponding to the semiconductor chilling plate in shape, and the connecting plate is connected with the heat release radiator through an elastic connecting device; a semiconductor chilling plate is arranged at the rear part of the through hole, and the hot end of the semiconductor chilling plate is attached to the heat-releasing radiator; the cold end is connected with the heat-conducting block and the heat-absorbing radiator; a heat insulation pad is arranged between the connecting plate and the heat absorption radiator; the connecting plate is fixedly connected with the heat absorption radiator; a protective cover is arranged outside the heat absorption radiator; a water collecting tank is arranged below the lower cover plate; a fan is arranged on a</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240628&DB=EPODOC&CC=CN&NR=118265270A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240628&DB=EPODOC&CC=CN&NR=118265270A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MA JIXIAN</creatorcontrib><creatorcontrib>WANG CHANGBAO</creatorcontrib><creatorcontrib>LING YOULIN</creatorcontrib><creatorcontrib>JING GUOLIANG</creatorcontrib><title>Cooling and heat dissipation system of ship electric cabinet</title><description>A cooling and heat dissipation system of a ship electric cabinet comprises a connecting plate, a semiconductor chilling plate, a heat insulation pad, a heat absorption radiator and a heat release radiator, the connecting plate is provided with a through hole corresponding to the semiconductor chilling plate in shape, and the connecting plate is connected with the heat release radiator through an elastic connecting device; a semiconductor chilling plate is arranged at the rear part of the through hole, and the hot end of the semiconductor chilling plate is attached to the heat-releasing radiator; the cold end is connected with the heat-conducting block and the heat-absorbing radiator; a heat insulation pad is arranged between the connecting plate and the heat absorption radiator; the connecting plate is fixedly connected with the heat absorption radiator; a protective cover is arranged outside the heat absorption radiator; a water collecting tank is arranged below the lower cover plate; a fan is arranged on a</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBxzs_PycxLV0jMS1HISE0sUUjJLC7OLEgsyczPUyiuLC5JzVXIT1MozsgsUEjNSU0uKcpMVkhOTMrMSy3hYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyalAVfHOfoaGFkZmpkbmBo7GxKgBANxaL7k</recordid><startdate>20240628</startdate><enddate>20240628</enddate><creator>MA JIXIAN</creator><creator>WANG CHANGBAO</creator><creator>LING YOULIN</creator><creator>JING GUOLIANG</creator><scope>EVB</scope></search><sort><creationdate>20240628</creationdate><title>Cooling and heat dissipation system of ship electric cabinet</title><author>MA JIXIAN ; WANG CHANGBAO ; LING YOULIN ; JING GUOLIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118265270A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MA JIXIAN</creatorcontrib><creatorcontrib>WANG CHANGBAO</creatorcontrib><creatorcontrib>LING YOULIN</creatorcontrib><creatorcontrib>JING GUOLIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MA JIXIAN</au><au>WANG CHANGBAO</au><au>LING YOULIN</au><au>JING GUOLIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Cooling and heat dissipation system of ship electric cabinet</title><date>2024-06-28</date><risdate>2024</risdate><abstract>A cooling and heat dissipation system of a ship electric cabinet comprises a connecting plate, a semiconductor chilling plate, a heat insulation pad, a heat absorption radiator and a heat release radiator, the connecting plate is provided with a through hole corresponding to the semiconductor chilling plate in shape, and the connecting plate is connected with the heat release radiator through an elastic connecting device; a semiconductor chilling plate is arranged at the rear part of the through hole, and the hot end of the semiconductor chilling plate is attached to the heat-releasing radiator; the cold end is connected with the heat-conducting block and the heat-absorbing radiator; a heat insulation pad is arranged between the connecting plate and the heat absorption radiator; the connecting plate is fixedly connected with the heat absorption radiator; a protective cover is arranged outside the heat absorption radiator; a water collecting tank is arranged below the lower cover plate; a fan is arranged on a</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN118265270A |
source | esp@cenet |
subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | Cooling and heat dissipation system of ship electric cabinet |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T03%3A21%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MA%20JIXIAN&rft.date=2024-06-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN118265270A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |