Pressure sensor packaging structure and preparation method thereof

The invention relates to the field of semiconductor packaging, in particular to a pressure sensor packaging structure and a preparation method thereof, the pressure sensor packaging structure comprises a substrate, an ASIC chip, an MEMS wafer, an LCP cover plate, a perforated metal sheet and a waterproof breathable film, the ASIC chip is fixed on the substrate, and the ASIC chip is bonded with the substrate; the MEMS wafer is fixed on the ASIC chip, and the MEMS wafer is bonded with the ASIC chip; the bottom of the LCP cover plate is connected with the substrate, the top of the LCP cover plate is connected with the perforated metal sheet, and the waterproof breathable film is arranged above the perforated metal sheet. According to the novel pressure sensor packaging structure scheme, the LCP cover plate is used as an enclosing wall for fixation, and the waterproof and breathable films are combined together, so that high-grade functions of water prevention, dust prevention, oil prevention and the like can be r