Photosensitive resin composition, LDI photosensitive dry film and preparation method of LDI photosensitive dry film

The invention discloses a photosensitive resin composition, an LDI photosensitive dry film and a preparation method of the LDI photosensitive dry film. The photosensitive resin composition comprises the following raw materials in parts by weight: 40-70 parts of alkali-soluble resin, 30-60 parts of a...

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Bibliographische Detailangaben
Hauptverfasser: JIN CHUANG, GAO JINLONG, FENG ZHIQIANG, XIONG JUAN, SHAO XINRONG, BO YUNKANG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a photosensitive resin composition, an LDI photosensitive dry film and a preparation method of the LDI photosensitive dry film. The photosensitive resin composition comprises the following raw materials in parts by weight: 40-70 parts of alkali-soluble resin, 30-60 parts of a photopolymerization monomer, 0.1-5 parts of an initiator, 0.1-5 parts of an additive and 10-40 parts of a first solvent, and the initiator comprises a photoinitiator and a cationic initiator; the preparation raw materials of the alkali-soluble resin comprise a double-bond polymeric monomer I with an oxygen heterocyclic ring and a benzene ring, the chemical structure of the alkali-soluble resin is as shown in the following formula 1: # imgabs0 #, R represents an H atom or an alkyl group, and Ar represents an aryl group. The alkali-soluble resin with strong adhesive force and self-cleaning capability is synthesized by utilizing a double-bond polymerization monomer containing a benzene ring structure and an oxygen he