High-temperature-resistant and high-toughness photosensitive resin for SLA 3D printing as well as preparation method and application of high-temperature-resistant and high-toughness photosensitive resin

The invention belongs to the technical field of photocuring printing, and provides high-temperature-resistant and high-toughness photosensitive resin for SLA 3D printing as well as a preparation method and application of the high-temperature-resistant and high-toughness photosensitive resin. The oli...

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Bibliographische Detailangaben
Hauptverfasser: WANG LEI, MENG YUANZHAN, LIANG PINGFAN, CAI HU
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention belongs to the technical field of photocuring printing, and provides high-temperature-resistant and high-toughness photosensitive resin for SLA 3D printing as well as a preparation method and application of the high-temperature-resistant and high-toughness photosensitive resin. The oligomer, the toughening agent and the initiator are used as main raw material components of the high-temperature-resistant and high-toughness photosensitive resin for SLA 3D printing, the oligomer comprises an acrylate oligomer and an epoxy resin oligomer, the acrylate oligomer comprises silicon modified polyurethane acrylate, and the epoxy resin oligomer comprises silicon modified polyurethane acrylate. The epoxy resin oligomer comprises bisphenol A epoxy resin and/or hydrogenated bisphenol A epoxy resin. A product prepared from the photosensitive resin provided by the invention has the advantages of low viscosity, high toughness, high temperature resistance, good mechanical property, high forming precision, high cu