Component inspection method and component inspection apparatus

This component inspection method captures an image of the upper surface of a substrate on which a component is mounted, acquires a color image in which the color of each pixel is represented by luminance values of a plurality of primary colors, extracts, as a specific pixel, a pixel having a luminan...

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description This component inspection method captures an image of the upper surface of a substrate on which a component is mounted, acquires a color image in which the color of each pixel is represented by luminance values of a plurality of primary colors, extracts, as a specific pixel, a pixel having a luminance value within a prescribed range corresponding to the color of the component, from among the pixels constituting the color image, and inspects the component on the specific pixel. An enhancement process for enhancing the brightness value of the extracted specific pixel is performed, and edge detection is performed on the color image subjected to the enhancement process to determine whether the component is mounted at the correct position. 本公开的元件检查方法对安装有元件的基板的上表面进行拍摄,取得以多个原色的亮度值表示各像素的颜色的彩色图像,提取构成彩色图像的各像素中的、具有与元件的颜色对应的规定范围的亮度值的像素作为特定像素,进行对提取出的特定像素的亮度值进行强调的强调处理,通过对实施了强调处理的彩色图像进行边缘检测,来判定元件是否被安装于正确的位置。
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Component inspection method and component inspection apparatus
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