BONDED BODY AND METHOD FOR PRODUCING SAME
Provided is a bonded body of a copper alloy and a steel and iron material, the bonded body having high adhesion at the interface between the copper alloy and the steel and iron material, and being capable of maintaining high strength without subsequent precipitation hardening treatment (or only prec...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | Provided is a bonded body of a copper alloy and a steel and iron material, the bonded body having high adhesion at the interface between the copper alloy and the steel and iron material, and being capable of maintaining high strength without subsequent precipitation hardening treatment (or only precipitation hardening treatment without solution treatment). The bonded body is provided with a first member comprising a precipitation hardening copper alloy, and a second member comprising a laminated molded article of a steel material bonded to the first member at at least one bonding interface. When a cross-section perpendicular to the bonding interface is observed using a scanning electron microscope (SEM), the bonded body does not have voids having a length of 50 [mu] m or more in a direction parallel to the bonding interface at the bonding interface.
本发明提供铜合金与钢铁材料的接合体,铜合金与钢铁材料的界面的密合性高,并且即使不进行随后的伴有固溶处理的析出硬化处理(或者仅进行不伴有固溶处理的析出硬化处理),也能够维持高强度。该接合体具备由析出硬化型铜合金构成的第一构件以及在至少一个接合界面接合于第一构件的包含钢铁材料的层叠造型物的第二构件。接合体在利用扫描型电子显微镜 |
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