LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

The embodiment of the invention provides a light-emitting device package and a manufacturing method thereof. According to the light-emitting device packaging piece, the first solder mask layer is arranged on the first non-welding area of the first electrode, and the second solder mask layer is arran...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WANG DAIQING, SANG YONGCHANG, LI JIANLIN, SHEN BINBIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The embodiment of the invention provides a light-emitting device package and a manufacturing method thereof. According to the light-emitting device packaging piece, the first solder mask layer is arranged on the first non-welding area of the first electrode, and the second solder mask layer is arranged on the second non-welding area of the second electrode, so that when the light-emitting device is connected with the first electrode and the second electrode in a welding mode, the light-emitting device can be welded. The flowing range of the welding material can be controlled by using the first solder mask layer and the second solder mask layer, so that the voidage of the first welding layer and the second welding layer is reduced, the connection stability between the light-emitting device and the first electrode and the second electrode is improved, and the heat dissipation effect of the light-emitting device is improved; and the problem that the light emitting brightness of the LED chip is attenuated due to