Copper etching liquid composition for reducing copper corrosion and etching crystallization after stripping and washing

The invention provides a copper etching liquid composition for reducing copper corrosion and etching crystallization after stripping and washing, and relates to a copper etching liquid composition. The cleaning agent is prepared from hydrogen peroxide, sulfuric acid, ethylenediamine tetramethyleneph...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN RUIXIANG, ZHENG HELI, WU HANG, HE PEIHAO, ZHANG NIANCHUN, ZHANG MUSHEN, WU HONGXING, YANG HOUGUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
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