Copper etching liquid composition for reducing copper corrosion and etching crystallization after stripping and washing

The invention provides a copper etching liquid composition for reducing copper corrosion and etching crystallization after stripping and washing, and relates to a copper etching liquid composition. The cleaning agent is prepared from hydrogen peroxide, sulfuric acid, ethylenediamine tetramethyleneph...

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Hauptverfasser: LIN RUIXIANG, ZHENG HELI, WU HANG, HE PEIHAO, ZHANG NIANCHUN, ZHANG MUSHEN, WU HONGXING, YANG HOUGUI
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Sprache:chi ; eng
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creator LIN RUIXIANG
ZHENG HELI
WU HANG
HE PEIHAO
ZHANG NIANCHUN
ZHANG MUSHEN
WU HONGXING
YANG HOUGUI
description The invention provides a copper etching liquid composition for reducing copper corrosion and etching crystallization after stripping and washing, and relates to a copper etching liquid composition. The cleaning agent is prepared from hydrogen peroxide, sulfuric acid, ethylenediamine tetramethylenephosphonic acid, acetoxime, glycollic acid, phosphoric acid, L-malic acid, 1, 2, 3, 4, 5-pentahydroxyhexanoic acid, polyvinyl alcohol and pure water. In the copper etching process, Cu < 2 + > in the copper etching liquid composition can react with O < 2-> to generate black CuO, when the solution reaches a saturated state, black precipitates can be generated, and meanwhile, after the copper etching liquid medicine is concentrated, crystals can be generated. The copper etching liquid composition disclosed by the invention has relatively strong chelating ability, and can reduce the content of Cu < 2 + > in a solution and reduce the generation of CuO; ethylenediamine tetramethylenephosphonic acid is used as a chelating a
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subjects CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
title Copper etching liquid composition for reducing copper corrosion and etching crystallization after stripping and washing
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