Method for forming power module package, power module package and electronic device
The invention provides a method for forming a power module package, the power module package and an electronic device. The method of forming a power module package includes providing a power module including at least one electrical component and at least one electrical connection portion; at least o...
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| creator | FENG YANGGUI LUO QUANSONG LIU XI XIA YANBING YANG KAIJIAN JIN LIANG |
| description | The invention provides a method for forming a power module package, the power module package and an electronic device. The method of forming a power module package includes providing a power module including at least one electrical component and at least one electrical connection portion; at least one electrical connection terminal is provided, each electrical connection terminal comprises a connection end, an extension part and an end cover, the extension part extends between the connection part and the end cover, and a cavity is formed in the extension part; arranging the at least one electrical connection terminal on the at least one electrical connection part in a one-to-one correspondence manner, and forming electrical connection between the connection end of the at least one electrical connection terminal and the at least one electrical connection part; encapsulating the power module and the at least one electrical connection terminal with an encapsulant to form an encapsulation body; removing at least |
| format | Patent |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRICITY LINE CONNECTORS |
| title | Method for forming power module package, power module package and electronic device |
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