Optical coupler packaging structure

Optical coupler packaging structure

The invention relates to the technical field of optical couplers, in particular to an optical coupler packaging structure. Through the arrangement of the ceramic substrate assembly and the conductive metal, on one hand, the tension resistance of the conductive metal can be improved, the possibility...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FANG CHENGYING, WANG CHAOJIN, ZHOU XINGXI, CHEN SHICAI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator FANG CHENGYING
WANG CHAOJIN
ZHOU XINGXI
CHEN SHICAI
description The invention relates to the technical field of optical couplers, in particular to an optical coupler packaging structure. Through the arrangement of the ceramic substrate assembly and the conductive metal, on one hand, the tension resistance of the conductive metal can be improved, the possibility of wire breakage is greatly reduced, and on the other hand, the voltage resistance of the product is improved to a certain extent through the relatively high insulation and voltage resistance of the ceramic substrate assembly; the ceramic substrate assembly is used for supporting and protecting the conductive metal, the voltage resistance performance can be further improved by enlarging an electric gap, the conductive metal cannot shake in the welding process, and therefore the welding yield is guaranteed under the condition that the voltage resistance performance is met, and in addition, the optical fiber and the light reflecting coating are arranged, so that the welding quality is improved. Compared with an optoc
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118073344A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118073344A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118073344A3</originalsourceid><addsrcrecordid>eNrjZFD2LyjJTE7MUUjOLy3ISS1SKEhMzk5Mz8xLVyguKSpNLiktSuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFQB2peakl8c5-hoYWBubGxiYmjsbEqAEABEQmxA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Optical coupler packaging structure</title><source>esp@cenet</source><creator>FANG CHENGYING ; WANG CHAOJIN ; ZHOU XINGXI ; CHEN SHICAI</creator><creatorcontrib>FANG CHENGYING ; WANG CHAOJIN ; ZHOU XINGXI ; CHEN SHICAI</creatorcontrib><description>The invention relates to the technical field of optical couplers, in particular to an optical coupler packaging structure. Through the arrangement of the ceramic substrate assembly and the conductive metal, on one hand, the tension resistance of the conductive metal can be improved, the possibility of wire breakage is greatly reduced, and on the other hand, the voltage resistance of the product is improved to a certain extent through the relatively high insulation and voltage resistance of the ceramic substrate assembly; the ceramic substrate assembly is used for supporting and protecting the conductive metal, the voltage resistance performance can be further improved by enlarging an electric gap, the conductive metal cannot shake in the welding process, and therefore the welding yield is guaranteed under the condition that the voltage resistance performance is met, and in addition, the optical fiber and the light reflecting coating are arranged, so that the welding quality is improved. Compared with an optoc</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240524&amp;DB=EPODOC&amp;CC=CN&amp;NR=118073344A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240524&amp;DB=EPODOC&amp;CC=CN&amp;NR=118073344A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FANG CHENGYING</creatorcontrib><creatorcontrib>WANG CHAOJIN</creatorcontrib><creatorcontrib>ZHOU XINGXI</creatorcontrib><creatorcontrib>CHEN SHICAI</creatorcontrib><title>Optical coupler packaging structure</title><description>The invention relates to the technical field of optical couplers, in particular to an optical coupler packaging structure. Through the arrangement of the ceramic substrate assembly and the conductive metal, on one hand, the tension resistance of the conductive metal can be improved, the possibility of wire breakage is greatly reduced, and on the other hand, the voltage resistance of the product is improved to a certain extent through the relatively high insulation and voltage resistance of the ceramic substrate assembly; the ceramic substrate assembly is used for supporting and protecting the conductive metal, the voltage resistance performance can be further improved by enlarging an electric gap, the conductive metal cannot shake in the welding process, and therefore the welding yield is guaranteed under the condition that the voltage resistance performance is met, and in addition, the optical fiber and the light reflecting coating are arranged, so that the welding quality is improved. Compared with an optoc</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD2LyjJTE7MUUjOLy3ISS1SKEhMzk5Mz8xLVyguKSpNLiktSuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFQB2peakl8c5-hoYWBubGxiYmjsbEqAEABEQmxA</recordid><startdate>20240524</startdate><enddate>20240524</enddate><creator>FANG CHENGYING</creator><creator>WANG CHAOJIN</creator><creator>ZHOU XINGXI</creator><creator>CHEN SHICAI</creator><scope>EVB</scope></search><sort><creationdate>20240524</creationdate><title>Optical coupler packaging structure</title><author>FANG CHENGYING ; WANG CHAOJIN ; ZHOU XINGXI ; CHEN SHICAI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118073344A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>FANG CHENGYING</creatorcontrib><creatorcontrib>WANG CHAOJIN</creatorcontrib><creatorcontrib>ZHOU XINGXI</creatorcontrib><creatorcontrib>CHEN SHICAI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FANG CHENGYING</au><au>WANG CHAOJIN</au><au>ZHOU XINGXI</au><au>CHEN SHICAI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Optical coupler packaging structure</title><date>2024-05-24</date><risdate>2024</risdate><abstract>The invention relates to the technical field of optical couplers, in particular to an optical coupler packaging structure. Through the arrangement of the ceramic substrate assembly and the conductive metal, on one hand, the tension resistance of the conductive metal can be improved, the possibility of wire breakage is greatly reduced, and on the other hand, the voltage resistance of the product is improved to a certain extent through the relatively high insulation and voltage resistance of the ceramic substrate assembly; the ceramic substrate assembly is used for supporting and protecting the conductive metal, the voltage resistance performance can be further improved by enlarging an electric gap, the conductive metal cannot shake in the welding process, and therefore the welding yield is guaranteed under the condition that the voltage resistance performance is met, and in addition, the optical fiber and the light reflecting coating are arranged, so that the welding quality is improved. Compared with an optoc</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN118073344A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Optical coupler packaging structure
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T10%3A19%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FANG%20CHENGYING&rft.date=2024-05-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN118073344A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true