Semiconductor structure and forming method thereof

The invention discloses a semiconductor structure and a forming method thereof, the structure comprises a wafer, the wafer comprises a substrate and a dielectric layer located on the substrate, an interconnection structure is formed in the dielectric layer, and the interconnection structure comprise...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SUI KAI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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