Resin composition for sealing light-emitting element, light source device, and method for producing light source device
Provided is a resin composition for producing a sealing member having excellent heat resistance and sealing properties. This resin composition for sealing a light-emitting element has at least one of the following two properties: (i) a polymer (P1) containing a structural unit (A) represented by for...
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| creator | KAWAMITSU SHOICHI SUGIMOTO NAOYA |
| description | Provided is a resin composition for producing a sealing member having excellent heat resistance and sealing properties. This resin composition for sealing a light-emitting element has at least one of the following two properties: (i) a polymer (P1) containing a structural unit (A) represented by formula (1) and a structural unit (B) having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxyl group, an epoxy group, an isocyanate group, and a cyano group; (ii) has a polymer (P2) containing a structural unit (A) and a polymer (P3) containing a structural unit (B). # imgabs0 #
本发明提供用于制作耐热性和密封性优异的密封构件的树脂组合物。在本发明的发光元件密封用树脂组合物中，以下两项中的至少1项成立：(i)具有聚合物(P1)，所述聚合物(P1)包含下述式(1)所示的结构单元(A)、以及具有选自含羰基的基团、羟基、环氧基、异氰酸酯基和氰基中的至少1种官能团的结构单元(B)；(ii)具有包含结构单元(A)的聚合物(P2)和包含结构单元(B)的聚合物(P3)。#imgabs0# |
| format | Patent |
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本发明提供用于制作耐热性和密封性优异的密封构件的树脂组合物。在本发明的发光元件密封用树脂组合物中，以下两项中的至少1项成立：(i)具有聚合物(P1)，所述聚合物(P1)包含下述式(1)所示的结构单元(A)、以及具有选自含羰基的基团、羟基、环氧基、异氰酸酯基和氰基中的至少1种官能团的结构单元(B)；(ii)具有包含结构单元(A)的聚合物(P2)和包含结构单元(B)的聚合物(P3)。#imgabs0#</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240517&DB=EPODOC&CC=CN&NR=118048007A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240517&DB=EPODOC&CC=CN&NR=118048007A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWAMITSU SHOICHI</creatorcontrib><creatorcontrib>SUGIMOTO NAOYA</creatorcontrib><title>Resin composition for sealing light-emitting element, light source device, and method for producing light source device</title><description>Provided is a resin composition for producing a sealing member having excellent heat resistance and sealing properties. This resin composition for sealing a light-emitting element has at least one of the following two properties: (i) a polymer (P1) containing a structural unit (A) represented by formula (1) and a structural unit (B) having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxyl group, an epoxy group, an isocyanate group, and a cyano group; (ii) has a polymer (P2) containing a structural unit (A) and a polymer (P3) containing a structural unit (B). # imgabs0 #
本发明提供用于制作耐热性和密封性优异的密封构件的树脂组合物。在本发明的发光元件密封用树脂组合物中，以下两项中的至少1项成立：(i)具有聚合物(P1)，所述聚合物(P1)包含下述式(1)所示的结构单元(A)、以及具有选自含羰基的基团、羟基、环氧基、异氰酸酯基和氰基中的至少1种官能团的结构单元(B)；(ii)具有包含结构单元(A)的聚合物(P2)和包含结构单元(B)的聚合物(P3)。#imgabs0#</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjD0LwjAURbs4iPofnnsLLQp2laI4OYh7CcltG0jyQvOqf1_8QHBzupzL4cyz-wXJBtLsIycrlgN1PFKCcjb05Gw_SAFvRZ4IB48g-funxNOoQQY3q5GTCoY8ZGDzasSRzaS_lV97mc065RJWn11k6-Ph2pwKRG6RotIIkLY5V1Vdbuuy3O03_zgPhL1F9w</recordid><startdate>20240517</startdate><enddate>20240517</enddate><creator>KAWAMITSU SHOICHI</creator><creator>SUGIMOTO NAOYA</creator><scope>EVB</scope></search><sort><creationdate>20240517</creationdate><title>Resin composition for sealing light-emitting element, light source device, and method for producing light source device</title><author>KAWAMITSU SHOICHI ; SUGIMOTO NAOYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118048007A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>KAWAMITSU SHOICHI</creatorcontrib><creatorcontrib>SUGIMOTO NAOYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAWAMITSU SHOICHI</au><au>SUGIMOTO NAOYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Resin composition for sealing light-emitting element, light source device, and method for producing light source device</title><date>2024-05-17</date><risdate>2024</risdate><abstract>Provided is a resin composition for producing a sealing member having excellent heat resistance and sealing properties. This resin composition for sealing a light-emitting element has at least one of the following two properties: (i) a polymer (P1) containing a structural unit (A) represented by formula (1) and a structural unit (B) having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxyl group, an epoxy group, an isocyanate group, and a cyano group; (ii) has a polymer (P2) containing a structural unit (A) and a polymer (P3) containing a structural unit (B). # imgabs0 #
本发明提供用于制作耐热性和密封性优异的密封构件的树脂组合物。在本发明的发光元件密封用树脂组合物中，以下两项中的至少1项成立：(i)具有聚合物(P1)，所述聚合物(P1)包含下述式(1)所示的结构单元(A)、以及具有选自含羰基的基团、羟基、环氧基、异氰酸酯基和氰基中的至少1种官能团的结构单元(B)；(ii)具有包含结构单元(A)的聚合物(P2)和包含结构单元(B)的聚合物(P3)。#imgabs0#</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | Resin composition for sealing light-emitting element, light source device, and method for producing light source device |
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