Grinding and thinning method for repairing wafer saw grains

The invention discloses a grinding and thinning method for repairing saw grains of a wafer, which comprises the following steps of: measuring the thickness of the cut wafer to obtain a first total thickness deviation; based on the first total thickness deviation, the thinning amount is determined; obtaining the thinning amount, and gradually and repeatedly mechanically thinning the main surface and the back surface of the wafer to a first preset thickness; carrying out first corrosion on the wafer reaching the first preset thickness; and thinning the back surface of the wafer until the wafer reaches a second preset thickness. According to the invention, the waste of raw materials is reduced, the problems of saw grains and uneven thickness generated after the wafer is cut are solved, and the quality and yield of the wafer are improved by accurately controlling the thinning process of the wafer. 本发明公开了一种修复晶圆锯纹的研磨减薄方法，包括如下步骤：对切割后的晶圆进行测厚，以获得第一总厚度偏差；基于所述第一总厚度偏差，确定减薄量；获取所述减薄量，并对所述晶圆的主面、背面进行逐步多次机械减薄至第一预设厚度；对达到第一预设厚度