Temperature distribution simulation method for in-situ thermocuring process

The invention discloses a temperature distribution simulation method for an in-situ thermocuring process. The method comprises the following steps: establishing an equivalent heat source load model of an in-situ thermocuring workpiece based on a visual angle coefficient model; after the three-dimens...

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Bibliographische Detailangaben
Hauptverfasser: TIAN LIXIN, YE JIAN, SU LIAN, YAO XINHUA, FENG SENWEN
Format: Patent
Sprache:chi ; eng
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