Temperature distribution simulation method for in-situ thermocuring process
The invention discloses a temperature distribution simulation method for an in-situ thermocuring process. The method comprises the following steps: establishing an equivalent heat source load model of an in-situ thermocuring workpiece based on a visual angle coefficient model; after the three-dimens...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a temperature distribution simulation method for an in-situ thermocuring process. The method comprises the following steps: establishing an equivalent heat source load model of an in-situ thermocuring workpiece based on a visual angle coefficient model; after the three-dimensional model of the workpiece and the working space are intersected, boundary basic unit elements are determined, and then unit elements to be activated are obtained; obtaining an analysis step unit according to the three-dimensional model and extracting an activation voxel, thereby constructing a free outer surface set of the activation voxel; inputting the equipment environment temperature and the air temperature into the model, outputting an equivalent heat source load and applying the equivalent heat source load to the free outer surface; a finite element simulation model is constructed based on the change process of thermophysical parameters of a curing material along with temperature and after grid division, a |
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