Wafer insulation, voltage resistance and aging test device

The invention relates to the field of wafer chip processing equipment, in particular to a wafer insulation, voltage resistance and aging test device which comprises an operation table, a moving plate, a heating disc, a probe card, a test plate, a linear driving mechanism and a lifting mechanism. The...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JIA SHILONG, MAO SAIJUN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator JIA SHILONG
MAO SAIJUN
description The invention relates to the field of wafer chip processing equipment, in particular to a wafer insulation, voltage resistance and aging test device which comprises an operation table, a moving plate, a heating disc, a probe card, a test plate, a linear driving mechanism and a lifting mechanism. The moving plate is slidably mounted at the top of the operating table, and the linear driving mechanism is mounted at the top of the operating table and used for driving the moving plate to slide in the length direction of the moving plate. A lifting plate is arranged at the top of the moving plate, and the lifting mechanism is mounted at the top of the operating table and used for driving the lifting plate to ascend and descend; the heating disc is mounted at the top of the lifting plate, the probe card is mounted at the top of the heating disc, and the test plate is located above the probe card; the top of the test board is provided with a nitrogen connector along the vertical direction, the top of the probe card i
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118011169A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118011169A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118011169A3</originalsourceid><addsrcrecordid>eNrjZLAKT0xLLVLIzCsuzUksyczP01Eoy88pSUxPVShKLc4sLknMS05VSMxLUUhMz8xLVyhJLS5RSEkty0xO5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoYWBoaGhmaWjsbEqAEAcYou7A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer insulation, voltage resistance and aging test device</title><source>esp@cenet</source><creator>JIA SHILONG ; MAO SAIJUN</creator><creatorcontrib>JIA SHILONG ; MAO SAIJUN</creatorcontrib><description>The invention relates to the field of wafer chip processing equipment, in particular to a wafer insulation, voltage resistance and aging test device which comprises an operation table, a moving plate, a heating disc, a probe card, a test plate, a linear driving mechanism and a lifting mechanism. The moving plate is slidably mounted at the top of the operating table, and the linear driving mechanism is mounted at the top of the operating table and used for driving the moving plate to slide in the length direction of the moving plate. A lifting plate is arranged at the top of the moving plate, and the lifting mechanism is mounted at the top of the operating table and used for driving the lifting plate to ascend and descend; the heating disc is mounted at the top of the lifting plate, the probe card is mounted at the top of the heating disc, and the test plate is located above the probe card; the top of the test board is provided with a nitrogen connector along the vertical direction, the top of the probe card i</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240510&amp;DB=EPODOC&amp;CC=CN&amp;NR=118011169A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240510&amp;DB=EPODOC&amp;CC=CN&amp;NR=118011169A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JIA SHILONG</creatorcontrib><creatorcontrib>MAO SAIJUN</creatorcontrib><title>Wafer insulation, voltage resistance and aging test device</title><description>The invention relates to the field of wafer chip processing equipment, in particular to a wafer insulation, voltage resistance and aging test device which comprises an operation table, a moving plate, a heating disc, a probe card, a test plate, a linear driving mechanism and a lifting mechanism. The moving plate is slidably mounted at the top of the operating table, and the linear driving mechanism is mounted at the top of the operating table and used for driving the moving plate to slide in the length direction of the moving plate. A lifting plate is arranged at the top of the moving plate, and the lifting mechanism is mounted at the top of the operating table and used for driving the lifting plate to ascend and descend; the heating disc is mounted at the top of the lifting plate, the probe card is mounted at the top of the heating disc, and the test plate is located above the probe card; the top of the test board is provided with a nitrogen connector along the vertical direction, the top of the probe card i</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAKT0xLLVLIzCsuzUksyczP01Eoy88pSUxPVShKLc4sLknMS05VSMxLUUhMz8xLVyhJLS5RSEkty0xO5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoYWBoaGhmaWjsbEqAEAcYou7A</recordid><startdate>20240510</startdate><enddate>20240510</enddate><creator>JIA SHILONG</creator><creator>MAO SAIJUN</creator><scope>EVB</scope></search><sort><creationdate>20240510</creationdate><title>Wafer insulation, voltage resistance and aging test device</title><author>JIA SHILONG ; MAO SAIJUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118011169A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>JIA SHILONG</creatorcontrib><creatorcontrib>MAO SAIJUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JIA SHILONG</au><au>MAO SAIJUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer insulation, voltage resistance and aging test device</title><date>2024-05-10</date><risdate>2024</risdate><abstract>The invention relates to the field of wafer chip processing equipment, in particular to a wafer insulation, voltage resistance and aging test device which comprises an operation table, a moving plate, a heating disc, a probe card, a test plate, a linear driving mechanism and a lifting mechanism. The moving plate is slidably mounted at the top of the operating table, and the linear driving mechanism is mounted at the top of the operating table and used for driving the moving plate to slide in the length direction of the moving plate. A lifting plate is arranged at the top of the moving plate, and the lifting mechanism is mounted at the top of the operating table and used for driving the lifting plate to ascend and descend; the heating disc is mounted at the top of the lifting plate, the probe card is mounted at the top of the heating disc, and the test plate is located above the probe card; the top of the test board is provided with a nitrogen connector along the vertical direction, the top of the probe card i</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN118011169A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title Wafer insulation, voltage resistance and aging test device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T06%3A44%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JIA%20SHILONG&rft.date=2024-05-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN118011169A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true